Multi-Objective Parallel Batch Scheduling In Wafer Fabs With Job Timelink Constraints

Elaoud, Semya; Williamson, Ruaridh; Sanli, Begun Efeoglu; Xenos, Dennis

doi:10.1109/wsc52266.2021.9715465

Cited by 4 publications

(2 citation statements)

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“…To effectively improve the production efficiency and yield rate of wafers, many scholars have extensively investigated these problems regarding the scheduling and control of single-armed cluster tools with different constraints. For example, since the batches have different operating costs and consecutive steps of a job are constrained with time links, Kim et al [15] present a hybrid twostage solution strategy, combining Mixed Integer Linear Programming (MILP) models and heuristics and minimizes the total weighted batching cost, queuing time, and the number of violations of time link constraints. May et al [16] present a data-based decision process to predict time constraint adherence in semiconductor manufacturing, analyzes the real-world historical data, and derives the appropriate statistical models and scoring functions, and so on.…”

Section: ) Scheduling Analysis and Optimizing Of Cluster Toolsmentioning

confidence: 99%

“…It can be seen from ( 15) that the larger the attenuation time, the larger the amplitude of the vibration attenuation of the system, and θ1m , θ2m , θ3m are smaller. When the values of θ1m , θ2m , θ3m are determined, the attenuation time t can be calculated according to the values required for θ1m , θ2m , θ3m by using (15).…”

Section: Vibration Attenuation Characteristicsmentioning

confidence: 99%

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Influence of Dynamic Accuracy Constraints of Manipulator of Wafer Transmission Robot on Scheduling and Control of Single-Armed Cluster Tools

Zheng

2023

IEEE Access

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The wafer transfer robot is a key part of integrated circuit equipment which performs the transit of wafers precisely, quickly and steadily. The dynamic accuracy of the manipulator of the wafer transfer robot directly affects the quality of transferring and processing wafers and even the scheduling and control of the cluster tools. Thus, it is essential to study the influence of the dynamic accuracy of the manipulator of wafer transmission robots on the scheduling and control of cluster tools. In this paper, single-arm cluster tools are taken as the research object. The horizontal torsional vibration equations of the manipulator of the R-θ robot are constructed, and the torsional vibration attenuation characteristics of the manipulator are analyzed. Based on the torsional vibration equations, the intrinsic relationships between the dynamic accuracy of the manipulator and the waiting times of the manipulator are explored when the manipulator loads and unloads the wafers. Then the two-stage approach is proposed for the scheduling and control of single-arm cluster tools. The first stage determines the minimum waiting times of the manipulator according to the intrinsic relationships between the dynamic accuracy of the manipulator and the waiting times of the manipulator when the manipulator is waiting for loading and unloading wafers in each processing module and load lock. The second stage achieves the scheduling optimization and control of single-arm cluster tools with dynamic accuracy constraints and wafer residency time constraints by establishing a mathematical programming model for the scheduling and control of single-arm cluster tools. Finally, illustrative examples are presented to analyze the influence of the dynamic accuracy of the manipulator on the scheduling and control of single-arm cluster tools.

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Section: ) Scheduling Analysis and Optimizing Of Cluster Toolsmentioning

confidence: 99%

Section: Vibration Attenuation Characteristicsmentioning

confidence: 99%