Multi-Path Nanometric Cutting of Molecular Dynamics Simulation

Abstract

Molecular dynamics simulations for multi-path nanomachining process are performed to study the nanomachining mechanism, and to analysis the effect on the surface quality, the subsurface damaged layers, reciprocating cutting force. The results show that the prior cutting process is accompanied with the development of many dislocations. However, in the reciprocating cutting process, atoms are removed mainly by the compressing, extruding and attracting because the defects from the prior cutting process restrict the movement of dislocations. The cutting force from reciprocating cutting process shows more obvious size effect than that from the prior cutting process. Under the same total cutting depth and the different feeding depth, the total cutting force increases as the second feeding depth decreases. While the order degree of the subsurface of the nanostructure increases. The surface quality of the nanomachined surface and the shape of the scratched groove is relation closely to the offset distance of the tool. The affected zone from the second feeding cutting process is larger than that from the prior cutting process. The second feeding cutting force increases as the offset distance of the tool increase. It is noted that the second feeding cutting force is not zero but closed to 30 percent of the prior cutting force under the condition of the offset distance of the tool at 0a 0 . When the offset distance of the tool is 10a 0 , the reciprocating cutting force is up to 90 percent of the prior cutting force.

Nano-machining of materials: understanding the process through molecular dynamics simulation

“…For example, in the reciprocating cutting process, atoms are removed mainly by compressing, extruding and attracting because defects from the prior cutting process restrict the movement of dislocations [43]. The surface quality of a nano-machined surface and the shape of the scratched groove were found to have a close relationship to the offset distance of the tool.…”

The Nano-Cutting Mechanism Research of Polysilicon Based on Molecular Dynamics

“…To achieve the nanometric cutting simulation study of polycrystalline materials, the first problem to be solved is to establish a reasonable model of polycrystalline cutting. Currently, Xichun Luo [2], Shijin Chen [3] and others conducted an exploratory research on building the polycrystalline nano cutting model. In these cutting model, a variety of structural factors on the effect of the process are taken into consideration, such as, grain interior presence of point defects (vacancies and inclusions), line defects (dislocations), different grain crystal orientation (small angle grain boundaries).…”