2021
DOI: 10.1016/j.compscitech.2021.108899
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Multi-performance shape memory epoxy resins and their composites with narrow transition temperature range

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Cited by 43 publications
(23 citation statements)
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“…SMPs are fixed in a temporary shape under external and environmental conditions and restored to their original shape (permanent shape) under specific stimuli. SMPs can be divided into different types according to different stimulus responses such as heat [ 4 , 5 ], light [ 6 8 ], humidity [ 9 ], electric field [ 10 , 11 ], and magnetic field [ 12 , 13 ]. Although many stimuli trigger shape memory effects (SME), most are produced by direct or indirect heating.…”
Section: Introductionmentioning
confidence: 99%
“…SMPs are fixed in a temporary shape under external and environmental conditions and restored to their original shape (permanent shape) under specific stimuli. SMPs can be divided into different types according to different stimulus responses such as heat [ 4 , 5 ], light [ 6 8 ], humidity [ 9 ], electric field [ 10 , 11 ], and magnetic field [ 12 , 13 ]. Although many stimuli trigger shape memory effects (SME), most are produced by direct or indirect heating.…”
Section: Introductionmentioning
confidence: 99%
“…[12][13][14][15][16] For example, the combination of epoxy resin and carbon fiber is widely used to prepare fiber-reinforced composites for the structural parts of aircraft and wind turbines in the aerospace industry. 17,18 Moreover, due to the rise of integrated circuits and microelectronics, there is a burgeoning trend for the use of epoxy resins in printed circuit boards (PCBs), electronic podge, and other electronic industries. [19][20][21][22] Generally speaking, epoxy resins are a kind of raw material with a molecular weight from several hundred to several thousand with two or more epoxy functional groups in a molecular chain.…”
Section: Introductionmentioning
confidence: 99%
“…12–16 For example, the combination of epoxy resin and carbon fiber is widely used to prepare fiber-reinforced composites for the structural parts of aircraft and wind turbines in the aerospace industry. 17,18 Moreover, due to the rise of integrated circuits and microelectronics, there is a burgeoning trend for the use of epoxy resins in printed circuit boards (PCBs), electronic podge, and other electronic industries. 19–22…”
Section: Introductionmentioning
confidence: 99%
“…Recently, some new methods have been proposed to improve the deformability and mechanical properties of conventional epoxy resins by a molecular level design, such as long-chain structural deformable cross-linked polymers, 19 shape-memory resins, 20 and deformable CF/EP composites. 21 Topology is concerned with the properties of geometric objects that are preserved under continuous deformations. Kloxin 2 pointed out that the cross-linked network of thermoreversible dissociative CANs is a function of temperature, which has been verified in such studies.…”
Section: ■ Introductionmentioning
confidence: 99%
“…So far, there have been many reports on preparing reprocessable and deformable epoxy resins and their composites. Since the landmark report on silica-like malleable materials from permanent organic networks by Leibler in 2011, covalent adaptable networks (CANs) have become one of the hottest research topics in recent years. , A lot of efforts have been made in the preparation of complex, intelligent, and adaptive polymer materials, which are endowed with self-healing, , shape memory, , and recycling abilities. These great efforts blurred the division between thermoset and thermoplastic polymers. Recently, some new methods have been proposed to improve the deformability and mechanical properties of conventional epoxy resins by a molecular level design, such as long-chain structural deformable cross-linked polymers, shape-memory resins, and deformable CF/EP composites …”
Section: Introductionmentioning
confidence: 99%