Multi-Physics Simulation Modeling for SiP of RF Front-End with Microchannel

Ren, Pan; Liang, Yaya; Liu, Cong; Peng, Bo; Du, Pingan

doi:10.1109/icept63120.2024.10668572

2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024

DOI: 10.1109/icept63120.2024.10668572

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Multi-Physics Simulation Modeling for SiP of RF Front-End with Microchannel

Pan Ren,

Yaya Liang,

Cong Liu

et al.

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Multi-Physics Simulation Modeling for SiP of RF Front-End with Microchannel

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References 10 publications

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