Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Yan, Dingbang; Li, Zexian; Kong, Nizao; Huang, Min; Tian, Yexin; Fu, Liqin; Wen, Bingjie; Liu, Jinshui; Tan, Ruixuan; Han, Fei

doi:10.1039/d2ra04633d

Cited by 7 publications

(4 citation statements)

References 44 publications

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“…The existing related reports only focus on the TC of the composites but lack a systematic study on the properties of the composites, such as insulation and mechanical properties, to provide sufficient reference for future applications (shown in Figure 4b). 14,[18][19][20][21][22] In this work, the TC, electrical insulation, and mechanical properties of the composites were comprehensively analyzed to obtain the 40 wt.% alumina-filled 110 type composites with optimal integrated properties.…”

Section: Resultsmentioning

confidence: 99%

“…(a) Comprehensive performance comparison of various composites in this work. (b) Comparison of the comprehensive performance of 110 type composites containing 40 wt.% Al 2 O 3 , which has the best comprehensive performance in this work, with the reported particle gradation filled composites 14,18–22 . [Color figure can be viewed at wileyonlinelibrary.com]…”

Section: Resultsmentioning

confidence: 99%

“…There have been several studies using the Dinger-Funk equation to guide the size matching of particle gradation design in thermally conductive composites. 14,[18][19][20][21][22] However, relevant particle gradation filling theories in thermoplastic composites have been relatively little studied, and the effect of particle gradation filling systems on the electrical insulation strength of the composites has not been reported in these systems.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, particle gradation filling systems with well‐matched particle sizes can achieve lower nano‐micro‐scale porosity, thus promising to conduct high TC while achieving better insulation and mechanical properties. There have been several studies using the Dinger–Funk equation to guide the size matching of particle gradation design in thermally conductive composites 14,18–22 . However, relevant particle gradation filling theories in thermoplastic composites have been relatively little studied, and the effect of particle gradation filling systems on the electrical insulation strength of the composites has not been reported in these systems.…”

Section: Introductionmentioning

confidence: 99%

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Thermally conductive high‐voltage insulation composites with outstanding comprehensive properties through particle grading design

Feng,

Hao,

Song

et al. 2024

J of Applied Polymer Sci

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In order to meet the requirements of practical applications, the comprehensive performance of thermally conductive high‐voltage insulating composites is worth evaluating. Guided by the particle packing theory, spherical alumina particles with different particle size distributions were compounded and filled into low‐density polyethylene (LDPE), and the thermal conductivity (TC) and mechanical breakdown of different compound systems were systematically investigated. The results show that the particle grading design of small‐particle filled composites has better comprehensive properties than that of single‐scale or large‐particle filled composites, which proves the superiority and feasibility of particle grading design. The 110–40 wt.% composite has a higher TC (0.47 W/(m K)) compared with LDPE, while maintaining excellent insulation properties (227 kV/mm) and mechanical properties (tensile strength of 10 MPa and elongation at break of 720%). Finally, studies on the application of composite materials in the field of thermal management and ice melting of steel‐core aluminum insulated wires were applied, and both studies show good prospects for the applications of Al2O3/LDPE thermal conductive high‐voltage insulation composites.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermally conductive high‐voltage insulation composites with outstanding comprehensive properties through particle grading design

Feng,

Hao,

Song

et al. 2024

J of Applied Polymer Sci

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Contactless Scanning Near‐Field Optical Dilatometry Imaging at the Nanoscale

Wong,

Ezugwu,

Fanchini

2024

Adv Materials Inter

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To date, there are very few experimental techniques, if any, that are suitable for the purpose of acquiring quantitative maps of the thermal expansivity of 2D materials and nanostructured thin films with nanoscale lateral resolution in spite of huge demand for nanoscale thermal management, for example in designing integrated circuitry for power electronics. Besides, contactless analytical tools for determining the thermal expansion coefficient (TEC) are highly desirable because probes in contact with the sample significantly perturb any thermal measurements. Here, ω‐2ω near‐field thermoreflectance imaging is presented as a novel, all‐optical, and contactless technique to map the TEC at the nanoscale with precision. Testing of this technique is performed on nanogranular films of gold and multilayer graphene (ML‐G) platelets. With ω‐2ω near‐field thermoreflectance, it is demonstrated that the TEC of Au is higher at the metal‐insulator interface, with an average of (17.12 ± 2.30) ×10−6 K−1 in agreement with macroscopic techniques. For ML‐G, the average TEC is (−5.77 ± 3.79) x10−6 K−1 and is assigned to in‐plane vibrational bending modes. A vibrational‐thermal transition from graphene to graphite is observed, where the TEC becomes positive as the ML thickness increases. The nanoscale method here reported demonstrates results in excellent agreement with its macroscopic counterparts, as well as superior capabilities to probe 2D materials and interfaces.

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3D printable phase change based thermal interface material with lower total thermal resistance at operating temperature

Hou,

Ji,

Cui

et al. 2024

Journal of Energy Storage

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Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Abstract: A new carbon-based thermal conductive filler, a new calculation method of multi-scale spherical particle mixing and a model for predicting thermal conductivity by tap density.

Cited by 7 publications

References 44 publications

Thermally conductive high‐voltage insulation composites with outstanding comprehensive properties through particle grading design

Thermally conductive high‐voltage insulation composites with outstanding comprehensive properties through particle grading design

Contactless Scanning Near‐Field Optical Dilatometry Imaging at the Nanoscale

3D printable phase change based thermal interface material with lower total thermal resistance at operating temperature

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