“…In particular, the integrity of the bonded material system can be studied from a fundamental perspective by monitoring the interactions between two materials along the interfacial region at a molecular level by MD. Recently, some researchers used it to study the properties of bi-material systems, such as the chitin/protein interface [ 9 ], polyethylene/graphene interface [ 10 ], epoxy/S interface [ 11 ], carbon fiber reinforced polymers/wood interface [ 12 ], polyimides/S glass interface [ 13 ], hexagonal boron nitride/polyethylene interface [ 14 ], dihydroxyphenylalanine/S interface [ 15 ], S/polystyrene interface [ 16 ], carbon nanotubes/epoxy interface [ 17 ], polyvinylidene fluoride binder/copper interface [ 18 ], epoxy/copper interface [ 19 ], etc. The tensile strength, shear strength, effects of strain rate, effects of cell size, effects of conversion, effects of temperature, interaction bonding energy, effects of entanglement, failure mode, confined condition, density profile, and failure strain have been extensively investigated.…”