2016
DOI: 10.1016/j.jmatprotec.2015.09.020
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Multi-spot laser lock-in thermography for real-time imaging of cracks in semiconductor chips during a manufacturing process

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Cited by 22 publications
(9 citation statements)
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“…First, the analysis area exposed to laser excitation needs to be determined within FOV because the line laser excitation may not cover the entire FOV. Assuming that the HIS system scans along the horizontal direction ( x -axis in Figure 4), the intensity profile of the line laser beam typically follows a Gaussian distribution 19 along the y -axis as shown in Figure 4. Thus, the analysis area can be determined by tracing the mid-points along the x -axis and their affected boundaries along the y -axis.…”
Section: The Deep Cnn–based Crack Evaluation Algorithmmentioning
confidence: 99%
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“…First, the analysis area exposed to laser excitation needs to be determined within FOV because the line laser excitation may not cover the entire FOV. Assuming that the HIS system scans along the horizontal direction ( x -axis in Figure 4), the intensity profile of the line laser beam typically follows a Gaussian distribution 19 along the y -axis as shown in Figure 4. Thus, the analysis area can be determined by tracing the mid-points along the x -axis and their affected boundaries along the y -axis.…”
Section: The Deep Cnn–based Crack Evaluation Algorithmmentioning
confidence: 99%
“…The superiority of the laser IR thermography over the vision-based techniques for crack detection is that it can detect subsurface damage as well as surface damage and is robust against sensing environments by employing laser excitation sources, which has been already proven by applying it to metallic structures and semiconductor chips. 18,19 However, the excessive sensitivity to crack detection may inversely disturb precise crack evaluation in concrete because of a number of non-structural-level initial concrete cracks.…”
Section: Introductionmentioning
confidence: 99%
“…The efficiency of the filters that extract only the useful components is essential for the proper operation of the lithography and metrology tools. Unfortunately, due to aging or other factors, spectral components outside the valid spectral range can penetrate into the optical system, deteriorate its performance, and even damage it [9] [10]. That is why it is crucial to have the capability to detect the presence of out-of-useful-spectrum components.…”
Section: Introductionmentioning
confidence: 99%
“…Despite the favorable results obtained through the application of AE techniques, their effectiveness is constrained by the complex nature of geological phenomena. In the field of mining and tunnel engineering, IRT is being promoted due to its noncontact and non-coupling nature, unlike other NDT methods (Schroeder et al 2002, Yang et al 2016. The technique provides easily interpretable data in the form of images or videos, and poses no risk of radiation exposure from the hazardous sources (Yang et al 2014).…”
Section: Introductionmentioning
confidence: 99%