2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2021
DOI: 10.1109/ectc32696.2021.00076
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Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration

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Cited by 20 publications
(2 citation statements)
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“…The three main oral functions are chewing, pronunciation, and esthetics. Recently, interest in esthetics has been increasing, such as teeth whitening or receiving orthodontic treatment for a beautiful face 18) .…”
Section: Discussionmentioning
confidence: 99%
“…The three main oral functions are chewing, pronunciation, and esthetics. Recently, interest in esthetics has been increasing, such as teeth whitening or receiving orthodontic treatment for a beautiful face 18) .…”
Section: Discussionmentioning
confidence: 99%
“…Current hybrid-bonding technologies for imagers are currently limited to two layers [1], while advanced hybrid bonding and TSVs integration was presented but not yet closely assembled togather [3,4]. Regarding the design for 3D pitches below 1µm, available CAD tools are not able to address it efficiently, current design solutions consists in tricking existing 2D place & route tools but still requiring separate placements [7].…”
Section: Introductionmentioning
confidence: 99%