Nowadays, one of the main reasons for increasing material performances is the need to reduce electromagnetic interference (EMI) generated by high-frequency electronic circuits, which is a serious problem in terms of equipment performances. For this purpose, copper is one of the most used materials for shielding applications. Plastic deformation at the macroscopic scale generates at the microscopic scale many moving dislocations (internal stresses) affecting the efficiency of the electromagnetic shielding. However, the plastic deformation which affects the electrical properties ensuring the shielding properties is still badly known and should be more studied and constitutes a promising research field. The main objective of this work is to study the effect of the copper plastic deformation on its electromagnetic shielding efficiency in the ]0-1GHz] frequency range. A series of electromagnetic shielding experiments was carried out by means of an Electro Magnetic Dual Transverse Cell (DTEM), on copper samples with a purity level of 99 % i) without plastic deformation ii) deformed with a rate of 2 % and 3 %. The results obtained clearly shown the variation of the electromagnetic shielding efficiency as a function of the copper plastic deformation rate.