Multifunctional mid-infrared photonic switch using a MEMS-based tunable waveguide coupler

Qiao, Qifeng; Yazici, Mahmut Sami; Dong, Bowei; Liu, Xinmiao; Lee, Chengkuo; Zhou, Guangya

doi:10.1364/ol.400132

Cited by 27 publications

(21 citation statements)

References 25 publications

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“…Dedicated optimization could be carried out to enhance the optical performance of the ring resonator. Other MEMS actuation architectures can be considered to enable a large displacement of photonic components, such as the in-plane comb drive and 3D integration [33,55].…”

Section: Discussionmentioning

confidence: 99%

“…The capability of on-chip reconfiguration is key to enable versatile and flexible optical systems, which may not be feasible with the static PIC components. Many types of reconfiguration mechanisms have been explored in the MIR region, including mechanical motion [32,33], free carrier injection [34,35], thermo-optic tuning [36], electro-refractive switching [37], and optical phase-change media [38]. As one of the most popular approaches in NIR silicon photonics, thermo-optic tuning remains useful in the MIR.…”

Section: Introductionmentioning

confidence: 99%

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Suspended Silicon Waveguide with Sub-Wavelength Grating Cladding for Optical MEMS in Mid-Infrared

et al. 2021

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Mid-infrared (MIR) photonics are generating considerable interest because of the potential applications in spectroscopic sensing, thermal imaging, and remote sensing. Silicon photonics is believed to be a promising solution to realize MIR photonic integrated circuits (PICs). The past decade has seen a huge growth in MIR PIC building blocks. However, there is still a need for the development of MIR reconfigurable photonics to enable powerful on-chip optical systems and new functionalities. In this paper, we present an MIR (3.7~4.1 μm wavelength range) MEMS reconfiguration approach using the suspended silicon waveguide platform on the silicon-on-insulator. With the sub-wavelength grating claddings, the photonic waveguide can be well integrated with the MEMS actuator, thus offering low-loss, energy-efficient, and effective reconfiguration. We present a simulation study on the waveguide design and depict the MEMS-integration approach. Moreover, we experimentally report the suspended waveguide with propagation loss (−2.9 dB/cm) and bending loss (−0.076 dB each). The suspended waveguide coupler is experimentally investigated. In addition, we validate the proposed optical MEMS approach using a reconfigurable ring resonator design. In conclusion, we experimentally demonstrate the proposed waveguide platform’s capability for MIR MEMS-reconfigurable photonics, which empowers the MIR on-chip optical systems for various applications.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Suspended Silicon Waveguide with Sub-Wavelength Grating Cladding for Optical MEMS in Mid-Infrared

et al. 2021

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“…Recently, a typical multifunctional photonic switch on the SOI platform operating in the mid-infrared (MIR) wavelength range (from 3.85 μm to 4.05 μm) has been reported [ 53 ]. They used suspended waveguides with sub-wavelength cladding and MEMS to tune the waveguide coupler.…”

Section: Fabrication Of Si- and Ge-based Thin Film-on-insulators Via Wafer Bonding Methodsmentioning

confidence: 99%

“…( c ) Transferred GeOI interface observed by TEM [ 40 ]. ( d ) A typical application of SOI in MEMS-based tunable waveguide coupler [ 53 ]. ( e ) A traditional application of SOI wafer in MIR slow light waveguide photodetector [ 54 ].…”

Section: Figurementioning

confidence: 99%

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Ren

et al. 2021

Micromachines

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Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.

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“…Recently, optical switching by exploiting mechanical effects in PICs has gained interest [1], primarily due to the potential for compact, low-loss and low-power optical switches. Several types of photonic MEMS switches have been demonstrated in the past years, with in-plane and out-of-plane moving electrostatic devices being the most prevalent [2]- [5].…”

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confidence: 99%

Broadband Compact Single-Pole Double-Throw Silicon Photonic MEMS Switch

Takabayashi

Sattari

Edinger

et al. 2021

J. Microelectromech. Syst.

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Photonic Integrated Circuits (PICs) benefit from the technology advances in the semiconductor industry to incorporate an ever-increasing number of photonic components on a single chip to create large-scale photonic integrated circuits. We here present a broadband, compact and low-loss Silicon Photonic MEMS switch based on a Single-Pole Double-Throw (SPDT) architecture, where curved electrostatic actuators mechanically displace a movable input waveguide to redirect the optical signal on chip efficiently to either of two output waveguides. The photonic switch has been fabricated in an established silicon photonics technology platform with custom MEMS release postprocessing. With a compact footprint of 65 × 62 µm 2 , the switch exhibits an extinction ratio exceeding 23 dB over 70 nm optical bandwidth, a low insertion loss and a fast response time below 1 µs, meeting the requirements for integration in large-scale reconfigurable Photonic Integrated Circuits. [2020-0391] Index Terms-Microelectromechanical systems, photonic integrated circuits, silicon photonics, photonics, optical switch. I. INTRODUCTION T HE field of Electronic Integrated Circuits (ICs) has experienced a remarkable development throughout the past decades, which has led to circuits with billions of switching transistors on a single chip, underpinning much of modern day computing. Equivalently, the field of Photonic Integrated Circuits (PICs) has recently seen tremendous progress in integration, whereby tens of thousands of optical components can be operated on a single chip. Among the enabling components Manuscript

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Multifunctional mid-infrared photonic switch using a MEMS-based tunable waveguide coupler

Cited by 27 publications

References 25 publications

Suspended Silicon Waveguide with Sub-Wavelength Grating Cladding for Optical MEMS in Mid-Infrared

Suspended Silicon Waveguide with Sub-Wavelength Grating Cladding for Optical MEMS in Mid-Infrared

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Broadband Compact Single-Pole Double-Throw Silicon Photonic MEMS Switch

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