Multifunctional polyether block amides/carbon nanostructures piezoresistive foams with largely linear range, enhanced and humidity-regulated microwave shielding

Development of Eco-Friendly and High-Strength Foam Sensors Based on Segregated Elastomer Composites with a Large Work Range and High Sensitivity

“…Piezoresistive sensors are widely used in various fields such as human-computer interaction, health monitoring, and human motion monitoring due to their low cost, simple structure, easy assembly, and distinctive signal. − However, traditional sensors (based on metals or semiconductors) have inevitable limitations in terms of flexibility, compressibility, and sensitivity. − To address these issues, conductive elastomer composites (CECs) have been used as flexibility sensors due to their lightweight, good elasticity, excellent stability, and long durability. − Additionally, studies have shown that introducing cell structures in CECs could notably improve sensing sensitivity, and endows sensors with good compressibility . Therefore, CEC foams have received significant attention as piezoresistive sensors. − Currently, the piezoresistive performances of CECs closely depend on the polymer matrix, conductive filler type, and preparation methods.…”

“…Thermoplastic elastomers are usually chosen as the matrix due to their good machinability, excellent elasticity, and long durability. − Polyether block amides, a novel thermoplastic elastomer, have outstanding flexibility and elasticity compared to other materials such as thermoplastic polyurethane (TPU) and styrene ethylene butylene styrene (SEBS). ,, This is conducive to the stability and durability of sensors. To form conductive paths in sensors, conductive fillers are employed.…”

Multifunctional Flexible AgNW/MXene/PDMS Composite Films for Efficient Electromagnetic Interference Shielding and Strain Sensing

“…Unfortunately, this issue will become even more significant with the rapid iteration of electronic information technology. − Therefore, developing electromagnetic interference (EMI) shielding materials with high flexibility and functional integrity is crucial to meet urgent shielding needs. Several conductive materials, such as carbon materials (graphene and carbon nanotubes), − metal nanowires, , and two-dimensional transition metal carbides and/or nitrides (MXenes), − have been widely used for EMI shielding. For example, Wang et al fabricated a 14.1 μm-thick MXene/amarid nanofiber nanocomposite paper exhibiting an excellent EMI shielding efficiency (SE) of 48 dB.…”

Preparation of microcellular polycaprolactone/cellulose nanocrystal/carbon black conductive composites using the Pickering emulsion method combined with supercritical batch foaming technology

“…So far, various methods have been developed to construct foam structures, such as physical foaming, 17 chemical foaming, 18 freeze-drying, 19 thermally induced phase separation, 20 and so on, among which the supercritical carbon dioxide (SCCO 2 ) foaming technologies have been successfully conducted to prepare m-CPCs. [21][22][23] SCCO 2 foaming process is environmentally friendly and not limited by severe operating conditions, and does not change the chemical structure of the materials. 24 However, it is still challenging to obtain m-CPCs with great conductivity and mechanical property, as well as uniform internal foams.…”

“…The preparation of m‐CPCs is a hybrid strategy consisting of two main steps, the first step is incorporating the conductive fillers into the polymer matrix by a certain method and then compression‐molding to obtain the solid composites, and the second step is constructing foam structures for the solid composites. So far, various methods have been developed to construct foam structures, such as physical foaming, 17 chemical foaming, 18 freeze‐drying, 19 thermally induced phase separation, 20 and so on, among which the supercritical carbon dioxide (SCCO 2 ) foaming technologies have been successfully conducted to prepare m‐CPCs 21–23 . SCCO 2 foaming process is environmentally friendly and not limited by severe operating conditions, and does not change the chemical structure of the materials 24 .…”