Multifunctional Thermally Conductive Composite Films Based on Fungal Tree‐like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers

Abstract

Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, "solvothermal & in situ growth" method is carried out to prepare "Fungal tree"-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of "suction filtration self-assembly and hotpressing". When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m • K) and excellent tensile strength of 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.

Composites of an Epoxy Resin (EP)/PVDF/NiCo-Graphene Nanosheet (GNS) for Electromagnetic Shielding

“…With the rapid development of highly integrated and multifunctional microelectronic devices, three-dimensional (3D) packaging has attracted wide attention. However, the resulting problems of high power density and heat dissipation are urgently needed to be solved so as to ensure the performance and working life of sophisticated devices. , Furthermore, with the vigorous development of electronic equipment, communication technology, and the internet of things (IoT), electromagnetic radiation has become the fourth source of pollution, which not only affects the normal operation of precision equipment, national information security, and military security but also causes serious harm to human health. , Therefore, it is highly essential to develop packaging materials with perfect thermal management ability and electromagnetic interference shielding effectiveness (EMI SE). In recent years, nanomaterials have attracted extensive attention from researchers in various fields.…”

Flexible, Flame-Resistant, and Anisotropic Thermally Conductive Aerogel Films with Ionic Liquid Crystal-Armored Boron Nitride

“…With the rapid development of artificial intelligence, fifth-generation mobile networks (5G), the Internet of Things, and other industries trigger a greater demand for high-performance electronic devices such as miniaturization, integration, and high-power consumption. − However, the integration of electronic devices is usually accompanied by an increase in power density, leading to an excessive accumulation of heat during operation of miniaturized devices due to their limited heat dissipation capability. , At present, thermal interface materials (TIMs) are a critical and integral part of electronic devices, relying on heat transport from thermal conductors to distribute undesired heat from electronic components to the surrounding environment. , The ideal TIMs needs not only high thermal conductivity but also versatility to meet complex operating conditions, including flexibility, heat resistance, and flame retardancy. , Polymer-based TIMs have outstanding advantages over metal or ceramic materials in terms of light weight, ease of addition, and excellent flexibility while still facing many critical issues, especially low thermal conductivity and high flammability before becoming ideal TIMs. , …”

Improvement of “point‐plane”‐like hetero‐structured fillers on thermal conductivity of poly(vinyl alcohol) composites

“…[ 38 ] For example, Han et al prepared “Fungal tree”‐like hetero‐structured fillers (AgNWs@BNNS) by in situ growth method, and the in‐plane TC of AgNWs@BNNS/aramid nanofibers composites reached 9.44 W/(m·K) at a filler content of 50 wt%. [ 39 ] Wang et al prepared “Line‐Plane”‐like hetero‐structured fillers (GO@MWCNTs) from modified multi‐walled carbon nanotubes and graphite by electrostatic self‐assembly method and prepared GO@MWCNTs/polydimethylsiloxane composites. The TC of GO@MWCNTs/polydimethylsiloxane composites reached 2.10 W/(m·K) at 20 wt% filler content, 950% higher than that of pure polydimethylsiloxane.…”