“…Integration of induction coils, capacitors and resistors in one small monolithic chip provides better performance and saves space with a higher level of integration on a printed circuit. Multicompound multilayer co-fired materials from soft magnetic material with high magnetic permeability and a dielectric mate-rial with a high dielectric constant at high frequencies, provide co-fired capacitor and inductor coil, and are one of the most interesting, but sophisticated approaches [1]. Mismatch compaction kinetics, chemical reactions and mismatch thermal expansion between the layers can generate undesirable defects such as delamination, crack, collapse and reduce performance secondary phase [2][3][4].…”