Multilevel logic and thermal co-simulation

Jani, Lazar; Poppe, A.

doi:10.1016/j.microrel.2016.08.019

Cited by 5 publications

(2 citation statements)

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“…Previous implementation of this simulation paradigm could accommodate exclusively standard cell descriptions of the circuits. Our latest results targeted the logi-thermal simulation of RTL descriptions [42]. By raising the abstraction level, and simulate only the critical path on gate level, the simulation time could be significantly reduced, while the error of the calculated temperature dependent delay was less than 3% [42].…”

Section: Thermal-aware Design Of Complex Digital Icsmentioning

confidence: 99%

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BME VIK Annual Research Report on Electrical Engineering and Computer Science 2016

Charaf

Harsányi

Poppe

et al. 2017

Period. Polytech. Elec. Eng. Comp. Sci.

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Preface Since being established in 1949, the Faculty of Electrical Engineering and Informatics (VIK) BME has played a flagship role in the development of electronics, IT and computer science in Hungary.We László Jakab (dean, BME VIK) János Levendovszky (vice-dean in charge of scientific affairs, BME VIK) are proud of combining engineering applications with sound scientific results, which is the assurance of high-level industrial collaboration leading to novel results and innovation. The various collaborations with our industrial partners has made it clear that the industry expects methods and results which make their industrial processes more effective and increase productivity and quality. Thus, participation in these collaborations give a competitive edge and ensure the continuous development of VIK. These factors have positioned our Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2016, the department organized and hosted a number of domestic and international events. In cooperation with the industry, AUT has organized the IoT4U conference. It was dedicated to Internet of Things, cloud and data management as well as the integration of IoT into various formats. RobonAUT, the yearly domestic amateur robotics contest was organized by the department in February 2016. The yearly contest is open to teams of students, organized either in student projects within the department or independent research teams.The next sections summarize the key research results of the department in year 2016. Software Development Methods and Mobile PlatformsThe diversity of mobile platforms necessitates the development of the same mobile application for all major mobile platforms, what requires considerable development effort. Mobile application developers are multiplatform developers, but they still prioritize the platforms, therefore, not all platforms are equally important for them. Appropriate methods, processes and tools are required to support the development in order to achieve better productivity.The research on educational mobile applications that adapt to the mental state of the user required a method for estimating the difficulty of tasks found in the serious games. There are generated or random assignments where the effort required from the user is not known or cannot be estimated in advance.61 (2) IoT and Smart CityThe Internet of Things (IoT) is transforming the surroun...

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Section: Thermal-aware Design Of Complex Digital Icsmentioning

confidence: 99%

“…This model was implemented in a conventional thermal field solver to augment the capability of simulating the thermal impact of integrated heat sink. This allows the study of the operation of system-on-package (SoP) devices by electro/logi-thermal simulation [32,42,43].…”

Section: Thermal Management and Reliability 241 Design And Realizatmentioning

confidence: 99%