Multiparameter Analysis of The Stress Field Around A Crack Tip

Guagliano, Mario; Sangirardi, Michele; Sciuccati, Augusto; Zakeri, Mahnaz

doi:10.1016/j.proeng.2011.04.486

Cited by 16 publications

(10 citation statements)

References 7 publications

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“…Multi-parameter fracture mechanics [17][18][19] is based on the analytical description of the stress and deformation fields in the body with crack by means of Williams expansion [16]. This infinite power series for a homogeneous elastic isotropic body can be expressed for the stress tensor {} and deformation vector {u} as 1 …”

Section: Multi-parameter Description Of the Stress And Displacement Fmentioning

confidence: 99%

Multi-parameter crack tip stress state description for estimation of fracture process zone extent in silicate composite WST specimens

Veselý¹,

Sobek²,

Šestáková³

et al. 2013

Frattura Ed Integrità Strutturale

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For wedge splitting test specimens, the stress and displacement fields both in the vicinity and also in larger distance from the crack tip are investigated by means of numerical methods. Several variants of boundary conditions were modeled. The stress intensity factor K, T-stress and even higher-order terms of William series were determined and subsequently utilized for analytical approximation of the stress field. A good fit between the analytical and numerical solution in dependence on the distance from the crack tip was shown, compared and discussed. Presented approach is considered as suitable for estimation of the fracture process zone extent in silicate composite materials.

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Section: Multi-parameter Description Of the Stress And Displacement Fmentioning

confidence: 99%

Multi-parameter crack tip stress state description for estimation of fracture process zone extent in silicate composite WST specimens

Veselý¹,

Sobek²,

Šestáková³

et al. 2013

Frattura Ed Integrità Strutturale

View full text Add to dashboard Cite

show abstract

“…The advent of computers coupled with developments in personal computer digital image processing has had a great influence in the development of modern photoelasticity [1][2][3][4][5][6][7][8]. The term "digital photoelasticity" refers to the automation of the photoelastic data collection and analysis [1].…”

Section: Introductionmentioning

confidence: 99%

“…The classical manual procedure of analysis is usually very tedious and time consuming and requires skilled and experienced personnel. With the advent of digital image processing techniques in photomechanics, digital photoelasticity has become very popular [1][2][3][4][5][6][7][8][9]. The development of the computer-aided analysis of the experimental data obtained from photoelastic experiment caused rapid growth of the photoelasticity experiments [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20], especially in fracture mechanics for analysis of the crack tip fields and crack tip parameters.…”

Section: Introductionmentioning

confidence: 99%

“…The development of the computer-aided analysis of the experimental data obtained from photoelastic experiment caused rapid growth of the photoelasticity experiments [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20], especially in fracture mechanics for analysis of the crack tip fields and crack tip parameters. In the past two decades crack-tip mechanics has been studied increasingly using full-field techniques, namely DIC [15] and photoelasticity [1][2][3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

“…Guaglianon [4] et al considered the multi-parameter description of the crack tip in isotropic linear elastic materials. The elastic stress field around a crack tip is fully defined through multiparameter equations.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Digital photoelasticity for calculating coefficients of the Williams series expansion in plate with two collinear cracks under mixed mode loading

Степанова¹,

Dolgikh²,

Turkova³

2017

Collection of Selected Papers of the III International Conference on Information Technology and Nanotechnology

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Photoelasticity method is used to study experimentally the complete Williams series expansion of the stress and displacement fields in the vicinity of the crack tip in isotropic linear elastic plates under Mixed Mode loading. The distribution of the isochromatic fridge patterns is employed for obtaining the stress field near the crack tip by the use of the complete Williams asymptotic expansion for various classes of the experimental specimens (plates with two collinear cracks under tensile loading and under mixed mode loading conditions). The higher order terms of the Williams series expansion are taken into account and the coefficients of the higher order terms are experimentally obtained. The stress field equation of Williams up to fifty terms in each in mode I and mode II has been considered. The comparison of the experimental results and the calculations performed with finite element analysis has shown the importance and significant advantages of photoelastic observations for the multi-parameter description of the stress field in the neighborhood of the crack tip.

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Influence of Contact Stresses on Crack-Tip Stress Field: A Multiparameter Approach Using Digital Photoelasticity

Ramaswamy,

Ramesh,

Saravanan

2024

Exp Mech

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Multiparameter Analysis of The Stress Field Around A Crack Tip

Cited by 16 publications

References 7 publications

Multi-parameter crack tip stress state description for estimation of fracture process zone extent in silicate composite WST specimens

Multi-parameter crack tip stress state description for estimation of fracture process zone extent in silicate composite WST specimens

Digital photoelasticity for calculating coefficients of the Williams series expansion in plate with two collinear cracks under mixed mode loading

Influence of Contact Stresses on Crack-Tip Stress Field: A Multiparameter Approach Using Digital Photoelasticity

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