Multiphysics coupling simulation of RDE for PCB manufacturing

Ji, Linxian; Wang, Chong; Wang, Shouxu; He, Wei; Xiao, Dingjun; Tan, Ze

doi:10.1108/cw-09-2014-0037

Cited by 13 publications

(19 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Electroplating is a surface treatment method widely used in manufacturing processes of electronic parts such as displays, mobile phones, semiconductors, etc. [1][2][3]. Deposition thickness uniformity is critical to improve product quality and productivity for these applications [4,5].…”

Section: Introductionmentioning

confidence: 99%

“…Because electroplating processes are affected by many parameters such as pH, temperature, current density, plating time, metal ions, concentration, agitation [6], and experimental approaches are difficult to estimate the effects of these parameters. So, many studies using simulation have been conducted for efficient studies [1][2][3][7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

“…The method is based on the assumption that the agitation of the electrolyte is sufficiently strong to achieve complete mixing. However, in many processes, the flow may not be uniform and not enough to make complete mixing, so unevenness of the deposition thickness appears because of non-uniform fluid flow [2].…”

Section: Introductionmentioning

confidence: 99%

“…In order to overcome this limitation, studies are underway to calculate the tertiary current distribution with additional consideration of the mass transfer effect due to the flow [1,2,8]. Low et al [1] and Ji et al [2] obtain the thickness of the diffusion layer through empirical equations. Inside the layer, electroplating is calculated considering the concentration gradient, and the outside is treated as a bulk having a constant concentration.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow

Lim

Lee

Yim

et al. 2019

J. Electrochem. Sci. Technol

View full text Add to dashboard Cite

Electroplating is a widely used surface treatment method in the manufacturing process of electronic parts and uniformity of the electrodeposition thickness is very crucial for these applications. Since many variables including fluid flow influence the uniformity of the film, it is difficult to conduct efficient research only by experiments. So many studies using simulation have been carried out. However, the most popular simulation technique, which calculates secondary current distribution, has a limitation on the considering the effects of fluid flow on the deposition behavior. And modified method, which is calculating a tertiary current distribution, is limited to a two-dimensional study of simple shapes because of the massive computational load. In the present study, we propose a new electroplating simulation method that can be applied to complex shapes considering the effect of flow. This new model calculates the electroplating process with three steps. First, the thickness of boundary layers on the surface of the cathode plane and velocity magnitudes at the positions are calculated from the simulation of fluid flow. Next, polarization curves of different velocities are obtained by calculations or experiments. Finally, both results are incorporated into the electroplating simulation program as boundary conditions at the cathode plane. The results of the model showed good agreements with the experimental results, and the effects of fluid flow of electrolytes on the uniformity of deposition thickness was quantitatively predicted.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow

Lim

Lee

Yim

et al. 2019

J. Electrochem. Sci. Technol

View full text Add to dashboard Cite

show abstract

“…Ji et al 29 have since considered the effect of the external flow field in copper plating for application in printed circuit boards; however, this simulation did not consider additives, which are essential to achieving void-free metallization of vias and trenches. A variant of the co-injection test, which parallels even closer the actual wafer plating process, is the 'direct immersion' test, where the polarization transient is measured when a polarized copper RDE is inserted 'live' into a copper plating solution containing the additives mixture.…”

mentioning

confidence: 99%

Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating

Boehme

Landau

2016

J. Electrochem. Soc.

View full text Add to dashboard Cite

The additives co-injection test is shown to provide important and unique insight into the bottom-up plating process. The observed transient peak polarization depends on the convective flow and reflects the electrode coverage by both the suppressor and the anti-suppressor species, much like the electrode coverage during the actual bottom-up plating process. A computer implemented analytical model of the co-injection test is presented. This model, which accounts for the additives transport through the flow-induced boundary layer and their adsorption kinetics, characterizes the actual wafer plating process more comprehensively than previous models, linking for the first time the wafer rotation rate to the process effectiveness. Correlating the model to experimental data provides the values of process parameters, including additives adsorption rates and their displacement constants, which heretofore were not accessible. It is found that previously reported values of diffusivities, saturated surface coverages, and the SPS adsorption rate constant are consistent with the presented co-injection model, however, values for the rate constants of PEG adsorption (k PEG ) and PEG displacement by SPS (k SPS,PEG ), which previously have only been inaccurately estimated, are now correctly quantified. The interconnects, which provide the intrinsic electrical wiring network in semiconductor devices, are fabricated by electroplating copper within vias and trenches, from electrolytes containing special additives. The latter control the plating rates such that the plating from the bottom of the features is enhanced, while plating on the sidewalls and the top wafer surface is inhibited.1 The variable plating rate is achieved by the additives distribution on the plated surface: additives which suppress plating, e.g., polyethers, adsorb preferentially on the wafer top surface and the rims of the features, while additives that block the adsorption of the suppressor, the so called 'anti-suppressors', predominantly accumulate at the features bottom, preventing suppressor adsorption at those locations and thus maintaining fast plating from the bottom. The interaction between these additives is imperative for achieving void-free bottom-up fill. Electrolytes containing common additives, polyethylene glycol [PEG] as suppressor and bis(3-sulfopropyl) disulfide [SPS] as anti-suppressor, have been studied extensively 1-28 and models have been developed to explain and characterize the bottom-up fill process. [5][6][7][8][9][10][11][12][13] Modeling and optimization of the interconnect metallization process requires the application of numerous process parameters, including the diffusion coefficients of the suppressor and the anti-suppressor, their surface adsorption rates, and their competitive interaction. The determination of many of these parameters is difficult and consequently their values had often only been estimated.11-13 Electrochemical tests such as the sequential injection technique have been used to provide adsorption constants with li...

show abstract

A generalized sample preparation method by incorporation of metal–organic compounds into polymers for electroless metallization

Atli

Trouillet

Aires

et al. 2020

J of Applied Polymer Sci

View full text Add to dashboard Cite

Polymer metallization is important for several applications but triggering of electroless deposition is problematic. A simple and inexpensive method to prepare the polymers for initiating the electroless copper deposition is successfully applied to Liquid Crystal Polymer and Polyethylene Terephthalate. The samples are prepared by incorporation of a small amount (<0.5 wt%) of metal–organic compounds (palladium, nickel, or copper acetates) in the molten polymers. During blending, the polymers are held at sufficiently high temperatures to thermally decompose the acetates, yielding the metallic particles (Pd, Ni, or Cu) which are used as the activators. After surface preparation, copper is deposited on polymers in an electroless bath including formaldehyde as reducer. The influence of bath parameters (temperature, composition) and the nature of activators is investigated. This method can be extended to other polymers by finding an appropriate polymer/metal–organic couple. It is also demonstrated that cheaper Ni or Cu can substitute expensive Pd.

show abstract

Multiphysics coupling simulation of RDE for PCB manufacturing

Cited by 13 publications

References 36 publications

Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow

Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow

Additives Co-Injection: A Test for Determining the Efficacy and Process Parameters of Bottom-up Plating

A generalized sample preparation method by incorporation of metal–organic compounds into polymers for electroless metallization

Contact Info

Product

Resources

About