Multiphysics Simulation of Nanopatterning in Electron Beam Lithography

Yasuda, Masaaki; Tada, Kazuhiro; Kotera, Masatoshi

doi:10.2494/photopolymer.29.725

Cited by 3 publications

(4 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Their inappropriate use may lead to unwanted irradiation defects, resist heating effects or charging effects. Such effects, which can be predicted inclusively through simulations [ 71 ], need to be eventually eliminated. For instance, when patterning fluoropolymers, the charging process during electron exposure becomes a serious issue as the insulator substrates covered with polymeric resists accumulate charges and degrade the EBL process.…”

Section: Top–down Lithographic Methodologiesmentioning

confidence: 99%

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

Handrea-Dragan

Botiz

2021

Polymers

View full text Add to dashboard Cite

There is an astonishing number of optoelectronic, photonic, biological, sensing, or storage media devices, just to name a few, that rely on a variety of extraordinary periodic surface relief miniaturized patterns fabricated on polymer-covered rigid or flexible substrates. Even more extraordinary is that these surface relief patterns can be further filled, in a more or less ordered fashion, with various functional nanomaterials and thus can lead to the realization of more complex structured architectures. These architectures can serve as multifunctional platforms for the design and the development of a multitude of novel, better performing nanotechnological applications. In this work, we aim to provide an extensive overview on how multifunctional structured platforms can be fabricated by outlining not only the main polymer patterning methodologies but also by emphasizing various deposition methods that can guide different structures of functional nanomaterials into periodic surface relief patterns. Our aim is to provide the readers with a toolbox of the most suitable patterning and deposition methodologies that could be easily identified and further combined when the fabrication of novel structured platforms exhibiting interesting properties is targeted.

show abstract

Section: Top–down Lithographic Methodologiesmentioning

confidence: 99%

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

Handrea-Dragan

Botiz

2021

Polymers

View full text Add to dashboard Cite

show abstract

“…During the exposure process [ 8 ], part of the light is absorbed by the photoresist [ 9 ], which generates photoacids [ 10 ] that change its solubility in the developer. Obtaining the desired size of the pattern requires controlling the photoacid distribution related to the light intensity distribution [ 11 ]. The expensive equipments and complicated process steps of the lithography process are time-consuming and costly.…”

Section: Introductionmentioning

confidence: 99%

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Sun

Liang

et al. 2023

Micromachines

View full text Add to dashboard Cite

Due to the widespread application of flexible printed circuit boards (FPCBs), attention is increasing being paid to photolithography simulation with the continuous development of ultraviolet (UV) photolithography manufacturing. This study investigates the exposure process of an FPCB with an 18 µm line pitch. Using the finite difference time domain method, the light intensity distribution was calculated to predict the profiles of the developed photoresist. Moreover, the parameters of incident light intensity, air gap, and types of media that significantly influence the profile quality were studied. Using the process parameters obtained by photolithography simulation, FPCB samples with an 18 µm line pitch were successfully prepared. The results show that a higher incident light intensity and a smaller air gap result in a larger photoresisst profile. Better profile quality was obtained when water was used as the medium. The reliability of the simulation model was validated by comparing the profiles of the developed photoresist via four experimental samples.

show abstract

“…The model used in the MD simulation was the same as that described in our previous work [9][10][11][12]. The PMMA film was divided into several thin layers.…”

Section: Simulation Modelmentioning

confidence: 99%

“…Molecular dynamics (MD) studies have become increasingly important in such atomic-scale pattern analysis [9][10][11][12]. However, MD simulations require long calculation times.…”

Section: Introductionmentioning

confidence: 99%

Multiscale Simulation of the Development Process in Electron Beam Lithography

Yasuda

Hitomi

Kawata

et al. 2017

J. Photopol. Sci. Technol.

Self Cite

View full text Add to dashboard Cite

Multiscale simulations are performed to study the development process in electron beam lithography. The whole pattern profiles are calculated with the cell removal simulation. The pattern profiles are shown to reflect the electron scattering manner in the resist. The local pattern structures are then studied by molecular dynamics simulation. The residual layer with a lot of voids, the residual polymer chains and concave sidewall reflecting the molecular structures are observed as typical atomic-scale pattern structures. The size of the pattern roughness is observed to be comparable with the molecular size of the resist. The diffusion process of the resist molecules among the developer molecules is also analyzed.

show abstract

Multiphysics Simulation of Nanopatterning in Electron Beam Lithography

Cited by 3 publications

References 18 publications

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

Multifunctional Structured Platforms: From Patterning of Polymer-Based Films to Their Subsequent Filling with Various Nanomaterials

Investigation into Photolithography Process of FPCB with 18 µm Line Pitch

Multiscale Simulation of the Development Process in Electron Beam Lithography

Contact Info

Product

Resources

About