“…Instead, air-based cooling solutions are generally more suitable for everyday devices, thanks to their reliability and cheapness. Among this category, innovative configurations have been lately studied to enhance the heat transfer capability and include the use of unshrouded plate fins [10], pin fin arrays [17,18], ribs [19][20][21], dimples [22,23], carbon nanotubes structures [24], arrays of protrusions [25,26], Pitot tubes [27], innovative roughened surfaces [28,29], porous media [30,31], phase-change materials [32,33], or metal foams [34,35].…”