Multiplicity features of nonadiabatic, autothermal tubular reactors

Lovo, Marianne; Balakotaiah, Vemuri

doi:10.1002/aic.690380112

Cited by 7 publications

(1 citation statement)

References 13 publications

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“…The prediction of steady-state multiplicity is intriguing and bears implications for thermally efficient heat-integrated microsystems constructed from thermally insulating materials. Much has been written on the subject of steady-state multiplicity in stirred pots and empty tubes, which has often been attributed to nonlinear kinetics, fluid-phase dispersion, or transport limitations within the catalyst. – It is important to note that for the case of isothermal packaging and sufficient CP and NTU corresponding to isothermal coolant and solid-phase conditions the system of equations reduces to a single plug-flow reacting fluid described by an initial-value ordinary differential equation which must yield a unique solution . The introduction of boundary-value equations describing the solid-phase temperature as well as any countercurrent flows in turn allows the possibility of multiple steady states .…”

Section: Resultsmentioning

confidence: 99%

Parametric Study of Solid-Phase Axial Heat Conduction in Thermally Integrated Microchannel Networks

Moreno

Murphy

Wilhite

2008

Ind. Eng. Chem. Res.

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A parametric study is presented to highlight design challenges of thermally integrated microchannel networks for portable chemistry and/or fuels reforming. One-dimensional modeling analysis of heat transfer in a twofluid system is presented for the case of (i) two nonreacting fluids (heat exchanger), (ii) a single exothermic reacting fluid and a second nonreacting fluid (regenerative combustor), and (iii) one exothermic reacting fluid and a second endothermic reacting fluid (heat exchanger reactor). In each case, the influence of solid-phase thermal conductivity and thermal packaging upon thermal efficiency, reaction conversion, and steady-state multiplicity is investigated. Results demonstrate the importance of both packaging and solid-phase axial thermal conduction upon system performance, with optimal performance obtained using low thermal conductivity substrates. Modeling analysis predicts steady-state multiplicity when employing low thermal conductivity materials, illustrating the need for future detailed stability analysis. Lastly, simplified mechanical analysis is presented to illustrate the value of coupled thermomechanical analysis.

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Section: Resultsmentioning

confidence: 99%