2013
DOI: 10.1063/1.4845596
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Multipoint vibrometry with dynamic and static holograms

Abstract: We report on two multipoint vibrometers with user-adjustable position of the measurement spots. Both systems are using holograms for beam deflection. The measurement is based on heterodyne interferometry with a frequency difference of 5 MHz between reference and object beam. One of the systems uses programmable positioning of the spots in the object volume but is limited concerning the light efficiency. The other system is based on static holograms in combination with mechanical adjustment of the measurement s… Show more

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Cited by 17 publications
(7 citation statements)
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“…Since the number of channels is limited due to the high cost of a vibrometer, the flexible adjustment of the measurement is essential. Such a system, which is capable of adjusting an arbitrary measurement grid, has been demonstrated by Haist et al [63]. The multichannel vibrometer has been realized as complex bulk-optics setup with holograms to split the laser light to multiple channels with homodyne [64] or heterodyne [65].…”
Section: Multi-beammentioning
confidence: 99%
“…Since the number of channels is limited due to the high cost of a vibrometer, the flexible adjustment of the measurement is essential. Such a system, which is capable of adjusting an arbitrary measurement grid, has been demonstrated by Haist et al [63]. The multichannel vibrometer has been realized as complex bulk-optics setup with holograms to split the laser light to multiple channels with homodyne [64] or heterodyne [65].…”
Section: Multi-beammentioning
confidence: 99%
“…Most available LDV systems use helium-neon (HeNe) laser sources at low power, not compatible with multi-channel configurations. Using bulk optics and holographic components, a flexible 12-channel vibrometer within a single optical head [10] has been realized. However, the alignment of the optics is very time consuming, difficult, and hence expensive.…”
Section: Introduction: Photonic Integration For Laser-doppler Vibrometrymentioning
confidence: 99%
“…On the static property side, higher-dynamic-range and higher-throughput dimensional metrology over larger wafer areas is becoming increasingly important in the semiconductor industry with the advances in microelectromechanical-system (MEMS) devices and three-dimensional stacked integrated circuits (3D-ICs) based on vertical interconnects with micro-bumps and through-silicon-vias (TSVs) 9 . So far, surface metrology using interferometry [10][11][12][13][14] and confocal microscopy 15,16 have been utilized, however, each method has limitations in terms of measurement range and speed, respectively.…”
Section: Introductionmentioning
confidence: 99%