Multiresolution sensor fusion approach to PCB fault detection and isolation

Wright, R.G.

doi:10.1109/autest.2008.4662581

Cited by 4 publications

(2 citation statements)

References 5 publications

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“…Currently, complex and expensive laboratory test systems exist to identify specific failure modes through acoustic imaging and analysis. These systems utilize Scanning Acoustic Microscopy (SAM), Laser Doppler Vibrometry, or a combination of multi-spectral techniques to produce images of circuits and chips for failure mode and fault analysis [14][15][16][17][18][19]. Other techniques involve measuring the acoustic emissions from electronics while the system-under-test is undergoing mechanical stress [7].…”

Section: Introductionmentioning

confidence: 99%

Experimental Studies of Conductive Paths of Printed Circuit Boards by Using Subminiature Eddy Current Transducers

2021

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This paper describes the development and experimental study of a software and hardware complex designed for studying the conductive tracks of printed circuit boards. In the course of this development, a subminiature eddy-current transducer and a measuring system capable of performing measurements using the newly developed transducer were created. The paper contains descriptions of the main parameters of the developed measuring system, and also presents the results of experiments conducted with various printed circuit boards, both with defect-free and those with artificial model defects. These experiments made it possible to confirm the possibility of using the developed measuring system and eddy-current transducer for controlling the conductive tracks on printed circuit boards and determining their quality.

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Section: Introductionmentioning

confidence: 99%

Experimental Studies of Conductive Paths of Printed Circuit Boards by Using Subminiature Eddy Current Transducers

2021

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“…Many short and open fault testing techniques have been developed on both ICs [2] and circuit boards [3][4]. Some testing methods such as stuck-at-fault model, bridging fault model and supplementary testing can no longer cover all the possible faults effectively due to the increasing number of faults [5].…”

Section: Introductionmentioning

confidence: 99%

3D electromagnetic simulation of interconnect fault inspection based on magnetic field behavior

Soeung

Ali

Khir

2013

RSM 2013 IEEE Regional Symposium on Micro and Nanoelectronics

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This paper presents the 3D electromagnetic simulation investigation of magnetic field behavior of faulty and fault free interconnects in Computer Simulation Technology (CST) Microwave Studio. The interconnects have been modeled in three conditions: short fault, open fault, and normal. The simulations of interconnect fault inspection have been performed on two different observations. First on the induced magnetic field intensity behavior where the conductive lines are excited by voltage ports. The induced magnetic field intensities are detected by virtual probes available in CST at the location of 3 mm above the lines. Second observation is on the changes of the induced voltages across the eddy current coil sensor. The interconnects are exposed to an alternating magnetic field generating secondary magnetic field. This field induces changes of voltage which are detected by eddy current sensor placed at 1.5 mm above the interconnects. The simulation results generated from both cases have shown that in the presence of the short faults on interconnect, the peak magnetic field intensity and induced voltage are higher compared to the normal or reference interconnect of 0.708 mV. Whereas, open or discontinuity faults on the lines induced lower magnetic field intensity and voltage compared to the normal lines voltage of 0.708 mV.

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