Nano-twinned copper exhibits an unusual combination of ultrahigh strength and high ductility, along with increased strain-rate sensitivity. We develop a mechanistic framework for predicting the rate sensitivity and elucidating the origin of ductility in terms of the interactions of dislocations with interfaces. Using atomistic reaction pathway calculations, we show that slip transfer reactions mediated by twin boundary are the rate-controlling mechanisms of plastic flow. We attribute the relatively high ductility of nanotwinned copper to the hardening of twin boundaries as they gradually lose coherency during plastic deformation. These findings provide insights into the possible means of optimizing strength and ductility through interfacial engineering.activation volume ͉ interfacial hardening ͉ nanoscale twins ͉ slip transfer reaction N anocrystalline metals with grain size finer than 100 nm routinely exhibit up to five times higher strength than their coarse-grained counterparts but suffer from greatly diminished ductility (1-3). showed that introduction of coherent nano-twins, typically tens of nanometers in thickness, in ultrafine-grained copper (with grain size of several hundred nanometers) leads to an unusual combination of ultrahigh strength (Ϸ1 GPa) and high ductility (14% elongation to failure). The plastic deformation characteristics of nanocrystalline metals have previously been rationalized on the basis of a number of mechanisms (7), including grain boundary (GB) sliding (8, 9), grain rotation (10), and diffusional creep (11). An effective experimental technique to probe the active deformation mechanism is to measure the sensitivity of flow stress to the rate of loading, ʈ because both the sensitivity index m and the associated activation volume v* can vary by orders of magnitude for different rate-limiting processes. For face-centered cubic metals such as copper, grain refinement into the nanocrystalline regime leads to an increase in m by up to an order of magnitude relative to microcrystalline metals with grain size in the micrometer range, and a concomitant decrease in the activation volume v* by two orders of magnitude (14,15). Nano-twinned copper shows the same characteristics of increased rate sensitivity and reduced activation volume as nanocrystalline copper without twins (4, 5, 12, 13) even when the average grain size is several hundred nanometers. However, it achieves very high strength without severely compromising ductility (4, 5).The commonly used strengthening model for nanocrystalline metals is the Hall-Petch relation (7, 16), which is a scaling function relating strength to grain size. The Hall-Petch relation is derived based on strengthening mechanisms (17) at internal interfaces, which proliferate in nanocrystals. However, it says nothing about ductility. To model ductility, it is necessary to revisit detailed physical processes at materials interfaces, in particular those involving dislocations, which are the carriers of plastic strain. Dislocation processes at internal interfac...