Electron-beam lithography is used extensively in nanoscience and technology for making masks for the semiconductor industry and, on a limited scale, for maskless lithography, that is, writing the patterns directly on the chip. We expect the latter application to extend in the years to come. Control of the dimensions of the written structures is essential in the semiconductor industry. For the 45 nm generation, which is presently under development and should reach production at the end of the decade, the required control over the line width is between 1.5 and 5 nm depending on the application. One of the factors of influence on the line width control is the statistics in the number of electrons illuminating the resist. This effect gives line edge roughness or, in other words: a lack of control over the local position of a resist edge. This has long been recognized and often been discussed. Recently, we developed an analytic model for the line edge position variation. The model, supported by Monte Carlo simulations, demonstrates that the line width variation is inversely proportional to the dose used for the illumination of the resist. This makes it impossible to increase the lithography throughput by developing ultrasensitive resists. For features written at the 45 nm generation with a typical resolution of 30 nm, a 30 µC/cm 2 resist gives 3σ line width variation of 3.5 nm over line segments 45 nm long. An expansion of the model demonstrates the dependence on the resolution, or blur, of the lithography machine.The line width is usually measured in an adapted critical dimension scanning electron microscope (CD-SEM). This measurement needs to be more precise than the result of the lithography step, so the requirements are typically sub-nm. Apart from all the problems to avoid systematic errors, this measurement also suffers from statistical variations, resulting from the finite number of electrons used for the measurement. We have derived an estimate for that variation with a similar model as used for the shot noise effect in the lithography step. Shot noise can usually be reduced by increasing the measurement time, but this is often not an option because many features must be inspected in a limited time. One of the conclusions is that for the most precise measurements of the line width it is not advisable to tune the CD-SEM for the best resolution. It is better to allow a larger probe size of the electron beam because that can be accompanied by a much larger current and thus a decrease in the noise level.
Design Approach for a Multi-Beam Electron Beam-Induced Deposition SystemB. VAN SOMEREN, M.J. VAN Electron beam-induced deposition (EBID) is a new application in scanning electron beam systems that has gained considerable interest in the past decade. If this application is used to make structures of 1 to 2 nm, 1-5 the time required for one operation increases with the resolution of the deposition. We are currently developing a multi-beam approach for EBID applications to decrease the time required to make a stru...