Multivariate study of a novel hydrometallurgical route employing chloride/hypochlorite for leaching silver from printed circuit boards

In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu2+ and O2 is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial Cu2+ concentration, and pulp density were investigated to examine the dissolution behavior of Cu from PCBs in 1 mol/L sulfuric acid. The kinetic studies were performed using the obtained leaching data. The leaching rate of Cu from PCBs was found to be higher on addition of Cu2+ and O2 to the leachant in comparison with the addition of O2 or both Cu2+ and N2 in the leachant. The leaching efficiency of Cu was found to be increased with increasing agitation speed, temperature, O2 flow rate, and initial Cu2+ concentration and decreasing pulp density. The 96% of Cu leaching efficiency was obtained under the following conditions: sulfuric acid concentration, 1 mol/L; temperature, 90 °C; agitation speed, 600 rpm; pulp density, 1%; initial Cu2+ concentration, 10,000 mg/L; and O2 flow rate, 1000 cc/min. The leaching data and analyses indicate that the Cu leaching from PCBs followed the reaction-controlled model satisfactorily and determined that the activation energy was found to be 23.8 kJ/mol. Therefore, these results indicate that the sulfuric acid solution with Cu2+ and O2 as a mild leach medium without strong oxidants such as HNO3, H2O2, and Fe3+ is valid for Cu leaching from PCBs.

Section: Introductionmentioning

confidence: 99%

Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen

Park

Eom

Yoo

et al. 2021

“…The halide leaching rate of gold is high (>95%) [189], leaching is selective to gold and the lixiviants are generally non-toxic [190]. Chloride leaching has been shown to be effective in leaching gold from ore (98%) [191] as well as in leaching palladium (93%) [155] and silver (95.29%) [192] from PCBs. However, this process is still hindered by several technical challenges including the emission of toxic chlorine gas, the need for specialised corrosion-resistant reactors and the consumption of high volumes of reagents [16].…”

Section: Leaching Process Example Of Reagent Referencementioning

confidence: 99%

E-Waste Recycling and Resource Recovery: A Review on Technologies, Barriers and Enablers with a Focus on Oceania

Yken

Boxall

Cheng

et al. 2021

107

Electronic e-waste (e-waste) is a growing problem worldwide. In 2019, total global production reached 53.6 million tons, and is estimated to increase to 74.7 million tons by 2030. This rapid increase is largely fuelled by higher consumption rates of electrical and electronic goods, shorter life cycles and fewer repair options. E-waste is classed as a hazardous substance, and if not collected and recycled properly, can have adverse environmental impacts. The recoverable material in e-waste represents significant economic value, with the total value of e-waste generated in 2019 estimated to be US $57 billion. Despite the inherent value of this waste, only 17.4% of e-waste was recycled globally in 2019, which highlights the need to establish proper recycling processes at a regional level. This review provides an overview of global e-waste production and current technologies for recycling e-waste and recovery of valuable material such as glass, plastic and metals. The paper also discusses the barriers and enablers influencing e-waste recycling with a specific focus on Oceania.

“…A combination of sodium chloride and calcium hypochlorite as the lixiviant was proposed for silver leaching from a magnetic fraction of PCBs [17]. Under experimental conditions, the degree of silver leaching was about 95%.…”

Section: Introductionmentioning

confidence: 99%

Study of Metal Leaching from Printed Circuit Boards by Improved Electrochemical Hydrochlorination Technique Using Alternating Current

Serga

Žarkov

Shishkin

et al. 2023

This paper presents the results of the leaching of metals from computer PCBs by electrochemical hydrochlorination using alternating current (AC) with an industrial frequency (50 Hz). Leaching was carried out with a disintegrator-crushed computer motherboard with a particle size (d) of <90 μm. In the course of the research, the leaching efficiency of metals including Fe, Sn, Mn, Al, Cu, Zn, Pb, Ni, Ti, Sb, Cr, Co and V was evaluated depending on process parameters, such as AC density, experiment duration, hydrochloric acid concentration in the electrolyte solution, solid/liquid ratio, electrolyte temperature, and the loading option of raw material (loading option 1 involving loading into the electrolyte solution, and loading option 2 involving loading into the filter containers attached to electrodes). The research results showed that AC superimposition significantly intensifies the leaching of metals. It was established that the complete leaching of metals including Al, Mn, Sn, Ti and Zn, under experimental conditions (loading option 2, CHCl = 6 mol·L−1, i = 0.80 A·cm−2, S/L = 8.6 g·L−1), is reached after 1.5 h, and that of Cu and Ni is reached after 2 h from the beginning of the experiment. At the same time, the degree of leaching of other metals after 2 h is Co-78.8%, Cr-84.4%, Sb-91.7%, Fe-98.9%, V-98.1% and Pb-5.1%. The paper also reports the results on the leaching of all abovementioned metals, as well as Ag and Pd, with disintegrator-crushed mixed computer PCBs with d < 90 μm and loading option 1.