Multiway Softness Polyurethane Elastomeric Composite with Enhanced Thermal Conductivity and Application as Thermal Interface Materials

Abstract

The ever‐increasing computing power in modern electronics comes with significant heat waste that can't be ignored. For microchips to dissipate heat efficiently, thermal interface materials (TIMs) are the most critical components in semiconductor packaging. Soft elastomer composites are often used as TIMs due to their large‐strain reversible deformability with a small external force. For TIMs to cushion between the microchip and heat spreader, they must have high thermal conductivity and temperature‐tunable softness to reduce thermal resistance and relieve the warpage failure caused by thermal stress. However, thermal conductivity and softness are interrelated and restrict each other. To address this challenge, a radical strategy of introducing dynamic covalent bonds in the polyurethane/aluminum composite is used. The reversible and low energy of dynamic imine bonds along with the lengthening of the Khun segment in the crosslinking network imbues the material with temperature‐tunable softness function while maintaining high thermal conductivity. The resulting polyurethane elastomer (PUE) composite exhibits remarkable thermal conductivity (6.90 W m−1 K−1), low thermal resistance (0.13 K cm2 W−1), and excellent softness (elastic modulus 759.50 kPa, and stretchability 140.30%). This work provides a practical method to design thermally conductive and temperature‐tunable soft elastomer composites as TIMs in semiconductor packaging.

Vanillin-Based Polymers via Ring-Opening Metathesis Polymerization

“…The hydroxyl functional group in vanillin often serves as a starting point for chemical transformation, enabling the synthesis of biobased polymers. For example, vanillin can be acrylated to form polymerizable vinyl monomers, which can then be polymerized using controlled radical polymerization techniques such as reversible addition–fragmentation chain transfer (RAFT) or atom transfer radical polymerization (ATRP) to produce functional polymers. − Additionally, by further cross-linking through the combination of aldehyde pendent groups of vanillin, biobased resins can be created. − While controlled radical polymerization offers many advantages, it also has inherent drawbacks, such as prolonged reaction times, high reaction temperatures, and chain transfer side reactions. In this context, ring-opening metathesis polymerization (ROMP) can serve as an excellent alternative to radical polymerization.…”

Preparation of an Aluminum Powder Composite with Double-Shell Nanostructure: Enhanced Thermal Conductivity Utilizing a Magnetic Orientation Effect

“…Their role is to fill the contact surface between the electronic device and the heat sink, which eliminates accumulated heat and maintains the life, capacity, and practicability of the electronic device. Thermally conductive fillers , are typically added to polymers − due to their poor inherent thermal conductivity. This results in composites that offer the benefits of polymers while also possessing high thermal conductivity, making them ideal solution.…”

Fast Degradable and Thermally Conductive Silicone Rubber Vitrimer with Low Dielectric and UV‐Shielding Properties

“…They are one of the crucial components in the encapsulation process of electronic devices. [ 6,7 ] Silicone rubber offers excellent flexibility, heat resistance, cold resistance, low dielectricity, and ease of processing, among other advantages. The elastomeric material prepared from silicone rubber exhibits characteristics such as low stress and high deformation, along with outstanding reversible deformability.…”