2019 Compound Semiconductor Week (CSW) 2019
DOI: 10.1109/iciprm.2019.8819128
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N-polar GaN HEMT with Al2O3gate insulator

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“…6,7) In addition, there is a potential to achieve lower ohmic resistance by means of direct contact between the GaN channel and ohmic electrodes. 8) Several groups have reported N-polar HEMTs, [7][8][9][10][11][12][13][14][15][16][17][18][19][20] which includes some recent outstanding high-frequency performance at 30 GHz 9,18) and 94 GHz, 9,17,19,20) and high-power performance with a breakdown voltage of over 2000 V. 12) A grand challenge in N-polar GaN HEMTs is to achieve a stable MIS (metal-insulator-semiconductor) gate structure because Schottky gates often suffer from a large gate leakage current. Choice of the gate stack, its deposition process, surface treatments, and the post-deposition process should be optimized for this purpose.…”
Section: Introductionmentioning
confidence: 99%
“…6,7) In addition, there is a potential to achieve lower ohmic resistance by means of direct contact between the GaN channel and ohmic electrodes. 8) Several groups have reported N-polar HEMTs, [7][8][9][10][11][12][13][14][15][16][17][18][19][20] which includes some recent outstanding high-frequency performance at 30 GHz 9,18) and 94 GHz, 9,17,19,20) and high-power performance with a breakdown voltage of over 2000 V. 12) A grand challenge in N-polar GaN HEMTs is to achieve a stable MIS (metal-insulator-semiconductor) gate structure because Schottky gates often suffer from a large gate leakage current. Choice of the gate stack, its deposition process, surface treatments, and the post-deposition process should be optimized for this purpose.…”
Section: Introductionmentioning
confidence: 99%