2003
DOI: 10.1002/adma.200390003
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n‐Type Building Blocks for Organic Electronics: A Homologous Family of Fluorocarbon‐Substituted Thiophene Oligomers with High Carrier Mobility

Abstract: A substantial enhancement of thermal stability, volatility, and electron affinity, switching the semiconducting behavior from p‐ to n‐type, is achieved by fluoroalkyl substitution of thiophene oligomers (see Figure). When this novel series is compared with the fluorine‐free analogues, trends in molecular packing, optical absorption, HOMO–LUMO gap, and π–π interactions are found to be strikingly similar.

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Cited by 322 publications
(178 citation statements)
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“…Thiophene oligomers 55 with perfluorohexyl groups also exhibited n-type characteristics. The highest mobility of 0.048 cm 2 Vs −1 was observed in the oligomer with a quarterthiophene core [56]. The oligomer 56 with pentafluorophenyl groups showed an electron mobility of 0.08 cm 2 Vs −1 [57].…”
mentioning
confidence: 93%
“…Thiophene oligomers 55 with perfluorohexyl groups also exhibited n-type characteristics. The highest mobility of 0.048 cm 2 Vs −1 was observed in the oligomer with a quarterthiophene core [56]. The oligomer 56 with pentafluorophenyl groups showed an electron mobility of 0.08 cm 2 Vs −1 [57].…”
mentioning
confidence: 93%
“…This can be explained by the fact that physisorption of moisture or oxygen occurs at grain boundaries. 62,73 If the grain boundaries reach deep into the material, moisture or oxygen can penetrate into the semiconductor and reach the semiconductor-dielectric interface acting as electron-trapping centres. Varying the growth rate allows larger molecules to fill the gaps of the layer below, reducing the number of grain boundaries.…”
mentioning
confidence: 99%
“…For designers, the right building materials can meet the design imagination and design needs. For engineering projects, the appropriate building materials can meet the appearance and functional requirements to the maximum extent [2]. Therefore, decoration material is the material carrier of architectural engineering construction application, architectural engineering conception creation and construction project value.…”
Section: Introductionmentioning
confidence: 99%