2016
DOI: 10.1088/0268-1242/31/6/065013
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N-type ohmic contacts to undoped GaAs/AlGaAs quantum wells using only front-sided processing: application to ambipolar FETs

Abstract: We report the development of a simple and reliable, front-sided-only fabrication technique for n-type ohmic contacts to two-dimensional electron gases (2DEGs) in undoped GaAs/AlGaAs quantum wells. We have adapted the well-established recessed ohmic contacts/insulated metal gate technique for inducing a 2DEG in an undoped triangular well to also work reliably for undoped square quantum wells. Our adaptation involves a change in the procedure for etching the ohmic contact pits to optimise the etch side-wall prof… Show more

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Cited by 11 publications
(9 citation statements)
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“…However the r i disorder corresponding to the resultant temperatures T is probably close to the actually frozen one. It should also be noted that the simulated freezing temperatures of localized charges are almost two times higher than the actual temperatures of post-growth dielectric and gate deposition operations [5][6][7][8][9][10][11][12].…”
Section: Comparison: Calculation Vs Experimentsmentioning
confidence: 92%
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“…However the r i disorder corresponding to the resultant temperatures T is probably close to the actually frozen one. It should also be noted that the simulated freezing temperatures of localized charges are almost two times higher than the actual temperatures of post-growth dielectric and gate deposition operations [5][6][7][8][9][10][11][12].…”
Section: Comparison: Calculation Vs Experimentsmentioning
confidence: 92%
“…In contrast to the standard modulation doping method, the 2D gas is in this case is created at low temperatures by bias V g between the metallic gate and metallic contacts connected to the GaAs working layer [5][6][7][8][9][10][11]. The charge on the surface of the GaAs protective layer is generated in equilibrium at V g = 0 and a high temperature, along with the image charge in the metal, and a common Fermi level is established in the metal / dielectric / undoped semiconductor structure (Fig.…”
Section: Test Object and Suggested Modelmentioning
confidence: 99%
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“…The AuGe/Ni/Au material was first used by [9] to make an ohmic contact to n-GaAs in 1967. Subsequent studies aimed at improving such contacts and understanding the annealing mechanisms [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24]. Later on, with the increasing importance of the 2DEG in a GaAs/Al x Ga 1−x As heterostructure, research focussed on making ohmic contacts to the buried 2DEG [25][26][27][28][29][30][31][32][33].…”
Section: Introductionmentioning
confidence: 99%
“…and length µ = L m 1120 , Ohmic contacts were fabricated as described in [7], and finally top-gate electrodes were deposited to induce and tune the carrier concentration. All measurements reported here were conducted in a He-3 cryostat with a base temperature of 0.3 K with magnetic fields of up to 10 T. Four-terminal constant current measurements were performed using standard low frequency (≈12 Hz) AC lock-in techniques.…”
mentioning
confidence: 99%