Amorphous and Nano Alloys Electroless Depositions 2016
DOI: 10.1016/b978-0-12-802685-4.00004-2
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Nano Electroless Plating

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Cited by 13 publications
(4 citation statements)
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“…Nanoprecipitation is a technique for preparing small particles that has the advantages of obtaining nanoparticles by gradually adding polymer solution to a non-solvent with a simpler, less toxic material use, and low cost [6,33]. A general definition of a nanomaterial is one that is smaller than 100 nm in one dimension and could be categorized as nanorod particles are those with aspect ratios greater than one but less than 20 [34,35]. All of our treated samples (Samples A-D in figure 2) led in nano-sized and rod morphology of the glutinous rice flour particles that were evenly distributed throughout all samples.…”
Section: Discussionmentioning
confidence: 99%
“…Nanoprecipitation is a technique for preparing small particles that has the advantages of obtaining nanoparticles by gradually adding polymer solution to a non-solvent with a simpler, less toxic material use, and low cost [6,33]. A general definition of a nanomaterial is one that is smaller than 100 nm in one dimension and could be categorized as nanorod particles are those with aspect ratios greater than one but less than 20 [34,35]. All of our treated samples (Samples A-D in figure 2) led in nano-sized and rod morphology of the glutinous rice flour particles that were evenly distributed throughout all samples.…”
Section: Discussionmentioning
confidence: 99%
“…The typical plating solution for copper electroless deposition involves the use of formaldehyde (CHOH) as a reducing agent, but this approach is becoming less popular due to formaldehyde’s high toxicity and trace amounts found in the final composites [ 26 ]. Formulations based on non-toxic reducing agents such as ascorbic acid (Asc) and glyoxylic acid (Gly), dimethylamine borane (DMAB), etc., are particularly noteworthy as an alternative to formaldehyde-based plating solutions [ 27 ].…”
Section: Introductionmentioning
confidence: 99%
“…5,[13][14][15][16] Zhang et al prepared Ni/Al 2 O 3 composite powder using acidic chemical plating, and various complexing agents, such as lactic acid and sodium acetate, were added to the plating. 17,18 The plated layer was amorphous, and the sintering temperature of the composite powder-modified ceramics decreased from 1700 to 1350 • C compared with the alumina-modified ceramics with a denseness of 96.8%.…”
Section: Introductionmentioning
confidence: 99%