Nano holes on micro pyramids; broadband optical light trapping in thin wafer based Si (&lt;100 µm) solar cells

Sekhar, Halubai; Kubota, Tomohiro; Kida, Yoshihisa; Fukuda, Tetsuo; Tanahashi, Katsuto; Takato, Hidetaka; Kondo, Michio; Samukawa, Seiji

doi:10.1109/nano.2016.7751349

Cited by 3 publications

(2 citation statements)

References 14 publications

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“…Improvements in the efficiency and performance of photovoltaic (PV) cells have been achieved by introducing new materials and concepts, such as organic (dye-sensitized), inorganic (Si QD) and hybrid (perovskite) solar cells. [1][2][3][4][5] Silicon-wafer-based solar cells have dominated the global market with a share exceeding 90% due to their abundant source material and well-known physical and chemical properties. 6) Crystalline silicon (c-Si) solar cells with thicknesses of 180-200 µm are now available in the market.…”

Section: Introductionmentioning

confidence: 99%

The impact of subsurface damage on the fracture strength of diamond-wire-sawn monocrystalline silicon wafers

Sekhar

Fukuda

Tanahashi

et al. 2018

Jpn. J. Appl. Phys.

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We describe a multi-diamond-wire saw for cutting monocrystalline silicon bricks into thin (120 µm) and thick (200 µm) wafers and label as freshand worn-wire sides. While almost no difference was found in the fracture stress of the thick (200 µm) wafers cut from either side, the thin (120 µm) wafers showed a lower fracture stress in those from the fresh-wire side compared to the worn-wire side. This is a remarkable result when wafers are sawn with conventional diamond wire. On the contrary, wafers sawn with improved diamond wire (100d-M6/12) showed a higher fracture stress compared to those cut with conventional diamond wire (100d-M8/16), for both the fresh-and worn-wire sides. Observing the subsurface areas of wafers by micro-Raman spectroscopy, we succeeded in quantifying the defective silicon fraction as the Raman crystallinity factor (Φ c ). We found that wafers having a higher fracture strength had a larger Φ c .

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Section: Introductionmentioning

confidence: 99%

The impact of subsurface damage on the fracture strength of diamond-wire-sawn monocrystalline silicon wafers

Sekhar

Fukuda

Tanahashi

et al. 2018

Jpn. J. Appl. Phys.

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show abstract

“…Improving cell efficiencies and reducing production costs are ongoing issues in the silicon (Si) photovoltaic (PV) industry and are being addressed by implementing innovative concepts and techniques. [1][2][3][4][5] Cutting Si bricks into wafers is the first step in the process of manufacturing Si solar modules. Wafer preparation costs including the sawing process accounts for approximately 30% of the total manufacturing cost.…”

Section: Introductionmentioning

confidence: 99%

The impact of saw mark direction on the fracture strength of thin (120 µm) monocrystalline silicon wafers for photovoltaic cells

Sekhar

Fukuda

Tanahashi

et al. 2018

Jpn. J. Appl. Phys.

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Using a multi-diamond-wire saw, we cut monocrystalline silicon bricks into thin (120 µm) wafers, on which we observed saw marks and elongated pits with surface cracks. To address the fracture issues, we performed three-line bending tests with the load applied in the parallel and perpendicular direction to the saw mark direction. Under parallel loading, pits and accompanying cracks resulted in lower fracture strength than under perpendicular loading and the wafers were clearly separated into two groups: lower-strength wafers from the fresh-wire side and higher-strength wafers from the worn-wire side. Under perpendicular loading, the pits and surface cracks had less effect, resulting in higher strength. Using Raman spectroscopy, we confirmed that the wafers from the fresh-wire side had a higher fraction of slicing damage on the surface and subsurface region than those from the worn-wire side. This damage resulted in lower-strength wafers in the parallel loading test.

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Advanced damage-free neutral beam etching technology to texture Si wafer with honeycomb pattern for broadband light trapping in photovoltaics

Sekhar¹,

Fukuda

Kubota

et al. 2021

J Mater Sci: Mater Electron

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Nano holes on micro pyramids; broadband optical light trapping in thin wafer based Si (<100 µm) solar cells

Cited by 3 publications

References 14 publications

The impact of subsurface damage on the fracture strength of diamond-wire-sawn monocrystalline silicon wafers

The impact of subsurface damage on the fracture strength of diamond-wire-sawn monocrystalline silicon wafers

The impact of saw mark direction on the fracture strength of thin (120 µm) monocrystalline silicon wafers for photovoltaic cells

Advanced damage-free neutral beam etching technology to texture Si wafer with honeycomb pattern for broadband light trapping in photovoltaics

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