Fine particle control is gathering attention in the field of semiconductor manufacturing, indoor environments and so on. In order to remove the fine particles, thin film electrodes were utilized, thus the electrostatic forces occurring on the electrode surface acted on the particles. The thin film electrode, with a discharge gap set to 25 µm, enabled the discharge to occur at the voltage of about 1 kV. Fifty micrometer SiO2 particles were used as the objective particles to be removed from the electrode surface. When an AC voltage of 1.0 kV and 500 Hz was applied to the electrode, the particles were transferred to the outside part of the electrodes and 94% of the particles were removed. Additionally, it was observed that removal rate varied with frequency of the applied voltage. We conclude that fine particles charged by the contact with the electrode and microplasma were transferred by the electrostatic forces.