2020
DOI: 10.1007/s42452-020-2205-6
|View full text |Cite
|
Sign up to set email alerts
|

Nanobundles structural Co-HKUST on the foamed nickel with a high supercapacitor performance

Abstract: In this work, we first successfully loaded the MOF structure Co-HKUST nanobundles on a foamed nickel without adding any binder. The Co-HKUST is a pseudo-capacitive material with excellent electrochemical performance as a unique energy storage material. As an electro-active material, such cobalt-based MOF exhibits superior pseudo-capacitive behavior in the KOH aqueous electrolyte with a high specific capacitance of 578.6 F g −1 at 1 A g −1 , and the specific capacitance remains 452.3 F g −1 when the current den… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2021
2021
2023
2023

Publication Types

Select...
5
1

Relationship

1
5

Authors

Journals

citations
Cited by 12 publications
(1 citation statement)
references
References 55 publications
0
1
0
Order By: Relevance
“…8 MOFs are porous materials with metal ions as the connection point and the 3D extension of space supported by organic ligands. [9][10][11] Due to their advantages of adjustable pore sizes, large specific surface areas and various structures, they are extensively used in energy storage. [12][13][14][15] However, oversized macrocyclic ligands are often present in the structure of MOFs, which makes them less attachable to conductive substrates, hindering their widespread application in electronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…8 MOFs are porous materials with metal ions as the connection point and the 3D extension of space supported by organic ligands. [9][10][11] Due to their advantages of adjustable pore sizes, large specific surface areas and various structures, they are extensively used in energy storage. [12][13][14][15] However, oversized macrocyclic ligands are often present in the structure of MOFs, which makes them less attachable to conductive substrates, hindering their widespread application in electronic devices.…”
Section: Introductionmentioning
confidence: 99%