Nanocrystalline metals prepared by low energy ball milling

Oleszak, D.; Shingu, Paul Hideo

doi:10.1063/1.361294

Cited by 143 publications

(55 citation statements)

References 18 publications

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“…Mechanical alloying (MA) is now recognized as a versatile process for the fabrication of a broad range of nanocrystalline powders. These powders include ODS alloys [198], amorphous alloys [202,203], nanocrystalline metals/alloys [204][205][206][207][208][209][210][211][212][213] and supersaturated solid solution [214,215]. The disadvantage of ball-milling for making nanocrystalline powders is the contamination of products from the milling media (balls and vial) and atmosphere.…”

Section: Solid Route 331 Mechanical Alloying/millingmentioning

confidence: 99%

“…Thus, the ultimate grain size achievable by MA is determined by the competition between the heavy mechanical deformation introduced during milling and the recovery behavior of the metal [206]. Oleszak and Shingu [208] then studied the influence of low energy ball milling (i.e. attrition milling) on the crystallite size, lattice strain and storage of deformation energies of bcc metals (e.g.…”

Section: Solid Route 331 Mechanical Alloying/millingmentioning

confidence: 99%

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Nanocrystalline materials and coatings

Tjong

Chen

2004

Materials Science and Engineering: R: Reports

844

345

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In recent years, near-nano (submicron) and nanostructured materials have attracted increasingly more attention from the materials community. Nanocrystalline materials are characterized by a microstructural length or grain size of up to about 100 nm. Materials having grain size of $0.1 to 0.3 mm are classified as submicron materials. Nanocrystalline materials exhibit various shapes or forms, and possess unique chemical, physical or mechanical properties. When the grain size is below a critical value ($10-20 nm), more than 50 vol.% of atoms is associated with grain boundaries or interfacial boundaries. In this respect, dislocation pile-ups cannot form, and the Hall-Petch relationship for conventional coarse-grained materials is no longer valid. Therefore, grain boundaries play a major role in the deformation of nanocrystalline materials. Nanocrystalline materials exhibit creep and super plasticity at lower temperatures than conventional micro-grained counterparts. Similarly, plastic deformation of nanocrystalline coatings is considered to be associated with grain boundary sliding assisted by grain boundary diffusion or rotation. In this review paper, current developments in fabrication, microstructure, physical and mechanical properties of nanocrystalline materials and coatings will be addressed. Particular attention is paid to the properties of transition metal nitride nanocrystalline films formed by ion beam assisted deposition process. #

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Section: Solid Route 331 Mechanical Alloying/millingmentioning

confidence: 99%

Section: Solid Route 331 Mechanical Alloying/millingmentioning

confidence: 99%

Nanocrystalline materials and coatings

Tjong

Chen

2004

Materials Science and Engineering: R: Reports

844

345

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“…Pulsed laser ablation [4], vacuum vapor deposition [5], pulsed wire discharge [6] and mechanical milling [7] are physical techniques while Chemical reduction [8], Microemulsion techniques [9], sonochemical reduction [10], Electrochemical [11], Microwave assisted [12], and hydrothermal [13] are chemical approaches for the synthesis of nanoparticles. Biological or biosynthesis [14] techniques are also considered as chemical methods.…”

Section: Introductionmentioning

confidence: 99%

A green method for the synthesis of Copper Nanoparticles using L-ascorbic acid

et al. 2014

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Chemical Reduction technique was employed to prepared highly stable and dispersed Copper nanoparticles using L-Ascorbic Acid (Vitamin C) as reducing as well as capping agent. In this technique, cupric chloride was used as precursor. The effects of different molar ratios of L-Ascorbic Acid on the concentration and size of copper nanoparticles were studied. The Copper nanoparticles were characterized by X-Ray Diffraction, Atomic Absorption Spectrometry, and Fourier Transform Infrared Spectrometry. The results show that with the increase in the molar ratio of L-ascorbic acid the concentration of Copper nanoparticles were also increased. The average particles size of copper nanoparticle was found in the range of 50-60 nm. The product was kept in ambient conditions for three month but no sedimentation or separation was observed. The use of ascorbic acid makes the process a non-toxic, cost effective and environmental friendly green method.

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“…As given in Table 2, the initial twin fault density β is significant within the nanoparticles. A high density of crystal defects is indeed generated during nanoparticle fabrication based on mechanical attrition [19]. Since the stacking fault energy of silver is very low (18 mJ·m -2 ), the external mechanical impact on nanoparticles can be accommodated through the formation of crystal twins.…”

Section: Resultsmentioning

confidence: 99%

Microstrain and Residual Stress in Thin-Films Made from Silver Nanoparticles Deposited by Inkjet-Printing Technology

Cauchois

Borbély²,

Gergaud

et al. 2014

AMR

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Abstract. Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin 2 ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjetprinting technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging.

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Nanocrystalline metals prepared by low energy ball milling

Cited by 143 publications

References 18 publications

Nanocrystalline materials and coatings

Nanocrystalline materials and coatings

A green method for the synthesis of Copper Nanoparticles using L-ascorbic acid

Microstrain and Residual Stress in Thin-Films Made from Silver Nanoparticles Deposited by Inkjet-Printing Technology

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