Proceedings of the 2011 American Control Conference 2011
DOI: 10.1109/acc.2011.5990929
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Nanofluid augmented coolant rail thermoelectric cooling of electronic systems—Modeling and analysis

Abstract: Modern electronic systems have reached a dimensional complexity and power density which presents numerous cooling challenges. A robust thermal management system is needed to provide the required heat transfer, especially while operating in harsh conditions such as elevated ambient temperatures. While liquid cooling combined with phase change materials has been shown to provide significant improvements in cooling performance, it is desired to develop a system capable of cooling electronic devices without endura… Show more

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Cited by 7 publications
(2 citation statements)
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“…To improve the thermal properties of a liquid, solid particles less than 100 nm are dispersed to the conventional coolants. This resulted in nanofluids being used instead of base fluids [1,2]. The most commonly used nanoparticles for nanofluids formulation are copper (Cu), aluminium (Al), magnesium (Mg), silicon (Si), silver (Ag), iron (Fe), titanium (Ti), zinc (Zn), carbon nanotubes (CNTs), graphene, graphene oxide, and diamond.…”
Section: Introductionmentioning
confidence: 99%
“…To improve the thermal properties of a liquid, solid particles less than 100 nm are dispersed to the conventional coolants. This resulted in nanofluids being used instead of base fluids [1,2]. The most commonly used nanoparticles for nanofluids formulation are copper (Cu), aluminium (Al), magnesium (Mg), silicon (Si), silver (Ag), iron (Fe), titanium (Ti), zinc (Zn), carbon nanotubes (CNTs), graphene, graphene oxide, and diamond.…”
Section: Introductionmentioning
confidence: 99%
“…Joshua et al mathematically analyzed and simulated a model of coolant rail thermoelectric coolers with enhanced nanoparticles for different cooling configurations. The results of the simulated system maintained low computer chip temperatures [22]. David et al simulated and analyzed the effect of nanofluid with thermoelectric module on computer chip temperature.…”
Section: Introductionmentioning
confidence: 99%