Nanomachining of van der Waals nanowires: Process and deformation mechanism

Yan, Yongda; Hu, Xin; Xu, Cheng‐Yan; Li, Yang; Geng, Yanquan

doi:10.1016/j.ijmachtools.2023.104018

Cited by 9 publications

(2 citation statements)

References 41 publications

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“…The smaller the tool edge radius is, the easier the chip separation; otherwise, the chip separation is more difficult. Also, from a molecular dynamics point of view [67], the smaller radius could reduce the force in the cutting process. Therefore, in the EV-chiseling process, the edge radius should be small enough.…”

Section: Finite Element Analysis (Fea) Of Microstructure Generationmentioning

confidence: 99%

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Li,

Zhang,

Zheng

et al. 2024

Int. J. Extrem. Manuf.

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High-aspect-ratio metallic surface microstructures are increasingly demanded in breakthrough applications, such as high-performance heat transfer enhancement and surface plasmon devices. However, the fast and cost-effective fabrication of high-aspect-ratio microstructures on metallic surfaces remains challenging for existing techniques. This study proposes a novel cutting-based process, namely elliptical vibration chiseling (EV-chiseling), for the high-efficiency texturing of surface microstructures with an ultrahigh aspect ratio. Unlike conventional cutting, EV-chiseling superimposes a microscale elliptical vibration on a backward-moving tool. The tool chisels into the material in each vibration cycle to generate an upright chip with a high aspect ratio through material deformation. Thanks to the tool’s backward movement, the chip is left on the material surface to form a microstructure rather than falling off. Since one microstructure is generated in one vibration cycle, the process can be highly efficient using ultrafast (>1 kHz) tool vibration. A finite element analysis model is established to explore the process mechanics of EV-chiseling. Next, a mechanistic model of the microstructured surface generation is developed to describe the microstructures’ aspect ratio dependency on the process parameters. Then, surface texturing tests are performed on copper to verify the efficacy of EV-chiseling. Uniformed micro ribs with a spacing of 1~10 μm and an aspect ratio of 2~5 have been successfully textured on copper. Compared with the conventional EV-cutting that uses a forward-moving tool, EV-chiseling can improve the aspect ratio of textured microstructure by up to 40 times. The experimental results also verify the accuracy of the developed surface generation model of microstructures. Finally, the effects of elliptical trajectory, depth of cut (DoC), tool shape, and tool edge radius on the surface generation of micro ribs have been discussed.

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Section: Finite Element Analysis (Fea) Of Microstructure Generationmentioning

confidence: 99%

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Li,

Zhang,

Zheng

et al. 2024

Int. J. Extrem. Manuf.

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“…To address this issue, we have recently reported a nanoskiving method for the fabrication of vertically oriented edges through the use of an ultramicrotome . This method used a linear-edge diamond tool to cut the basal plane of vdWs materials embedded in epoxy resin into one-dimensional edges at the nanoscale (Figure a,b).…”

Section: Introductionmentioning

confidence: 99%

Nanoskiving of van der Waals Materials toward Edge/Basal Plane Contact Heterojunctions for High-Performance Photodetection

Li,

Yan,

et al. 2024

ACS Appl. Mater. Interfaces

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The unique features of edges in van der Waals materials may lead to edge−basal plane contacts that could provide new opportunities for electronic and optoelectronic devices. However, few studies have addressed edge/basal plane contact heterojunctions owing to the formidable challenges in integrating edges with the basal plane to form a heterojunction. Here, taking the example of black phosphorus (BP)/ReS 2 , a heterojunction with contact between the edge and the basal plane was successfully achieved by the introduction of a nanoskiving technique to fabricate BP edges with controlled orientation, followed by the dry transfer of a ReS 2 flake. The deformation of BP during the nanoskiving process was clearly revealed, where interlayer slipping in the BP determined the formation of the edges. The edge/basal plane contact heterojunctions based on BP/ReS 2 exhibited a reverserectifying behavior upon contact, and a high rectifying current was attributed to direct tunneling and Fowler−Nordheim tunneling in low and high bias regimes, respectively. As a photodetector, the heterojunction diode demonstrated an impressive responsivity of 65 A/W, a rapid response time (<10 ms), and polarization-sensitive detection under 532 nm illumination without gate biasing.

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Observing Weak Interchain Coupling in 1D vdWs Ternary Mo₆Se₂I₈ to Achieve Probe Exfoliation of Ultrathin Molecular Chains

Guan,

Ding,

Fang

et al. 2024

Adv Funct Materials

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Abstractvan der Waals (vdWs) interchain coupling is a unique feature of 1D vdWs materials, where strong vdWs coupling in 1D vdWs materials leads to the thickness‐dependent physical properties, while weak vdWs coupling can preserve the single‐chain property even in their thick counterparts. Different from 2D vdWs materials, due to their nanoscale widths, identifying and producing ultrathin 1D molecular chains are challenging, severely limit their device applications. Thus, looking for novel 1D vdWs materials with weak interchain coupling is crucial. In this paper, the authors report that the 1D ternary vdWs material, Mo6Se2I8 with non‐centrosymmetric characteristic and strong optical anisotropy, exhibits weak interchain coupling. On one hand, the density functional theory (DFT) calculations theoretically demonstrate its thickness‐independent electronic structure, negligible interchain differential charge density, and weak cleavage energy as low as 0.256 J m−2. On the other hand, the thickness‐independent work function and low first‐order temperature coefficient of −0.0030 cm−1 K−1 further experimentally confirm its weak interchain coupling. Moreover, taking advantage of this weak vdWs coupling characteristic, the in situ exfoliation of the Mo6Se2I8 nanowires is achieved by using a nanoprobe in a scanning electron microscope (SEM), obtaining ultrathin molecular chains with a thickness of ≈1.2 nm.

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Nanomachining of van der Waals nanowires: Process and deformation mechanism

Cited by 9 publications

References 41 publications

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Nanoskiving of van der Waals Materials toward Edge/Basal Plane Contact Heterojunctions for High-Performance Photodetection

Observing Weak Interchain Coupling in 1D vdWs Ternary Mo₆Se₂I₈ to Achieve Probe Exfoliation of Ultrathin Molecular Chains

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Nanomachining of van der Waals nanowires: Process and deformation mechanism

Cited by 9 publications

References 41 publications

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

Nanoskiving of van der Waals Materials toward Edge/Basal Plane Contact Heterojunctions for High-Performance Photodetection

Observing Weak Interchain Coupling in 1D vdWs Ternary Mo6Se2I8 to Achieve Probe Exfoliation of Ultrathin Molecular Chains

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Observing Weak Interchain Coupling in 1D vdWs Ternary Mo₆Se₂I₈ to Achieve Probe Exfoliation of Ultrathin Molecular Chains