“…Once fully cured, a high-precision diamond wafering saw using an oil-based cutting lubricant sectioned the segments. A manual polishing system with a 200 mm diameter platen performed step-wise polishing of the cylindrical samples according to the method described previously [14,19] that used alumina suspensions in ethylene glycol and ethanol (50/50 mixture by volume) down to a particle size of 0.05 µm. A final polish of 0.05 µm was chosen since previous research has shown that a final polish with a particle size of less than 1 µm produces a flat surface for nanoindentation of cementitious materials [1,14,19,20].…”