Nanomesh of Cu fabricated by combining nanosphere lithography and high power pulsed magnetron sputtering and a preliminary study about its function

Xie, Wanchuan; Chen, Jiang; Jiang, Lang; Yang, Ping; Sun, Hong; Huang, Nan

doi:10.1016/j.apsusc.2013.06.045

Cited by 5 publications

(6 citation statements)

References 23 publications

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Section: Resultsmentioning

confidence: 99%

“…Another route so far used for the fabrication of plasmonic nanostructures is nanosphere lithography (NSL). [ 26–44 ] NSL may be viewed as an intermediate route of patterning because it is not based on self‐assembly, such as the bottom‐up processes, nor involves any slicing and dicing of continuous layers, as all top‐down processes. In this technique, a close packed, colloidal mask consisting of polystyrene (PS) or silica nanospheres is deposited usually by spin coating on the substrate and allows the deposition of the desired material vapors through the gaps among the nanospheres.…”

Section: Introductionmentioning

confidence: 99%

“…[ 26 ] On the contrary, the formation of well‐defined nanostructures by combining NSL with magnetron sputtering (MS) is exceptionally scarce. [ 34 ] The combination of NSL and MS usually results in a quasi‐continuous hexagonal mesh instead of isolated nanostructures [ 41–44 ] due to the lack of directionality of vapor species, which originates from the high working pressure of MS resulting in gas phase collisions; as a result, vapor is covering the entire space around the nanospheres beyond the shadow among them. [ 41–44 ] Reactive MS has not been implemented in combination with NSL so far.…”

Section: Introductionmentioning

confidence: 99%

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Etchless Fabrication of High‐Quality Refractory Titanium Nitride Nanostructures

Panos

Tselekidou

Kassavetis

et al. 2021

Physica Status Solidi (b)

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Nanosphere lithography has emerged as an efficient route to produce plasmonic nanostructures. Herein, the processes of nanosphere lithography and reactive magnetron sputtering that seem incompatible for a variety of reasons are reviewed and explained. However, understanding the physical obstacles of this combination enables us to identify a window of process parameters that make the deposition of well‐defined trigonal nanoislands of titanium nitride (TiN) feasible. TiN is used as a case study because it is a very good representative of refractory conductive nitrides, such as ZrN, HfN, NbN, and TaN. A UV ozone step is used to confine the triple‐junction vias of the polystyrene mask, and the reactive magnetron sputtering parameters are fine‐tuned to increase the directionality of deposited species, in particular the substrate‐to‐target distance is maximized to improve geometrical directionality, and a negative bias voltage is used to guide the ionic species deep into the vias. The proposed process produces well‐defined TiN nanoislands with low concentration of point defects that have similar structure with continuous films of high electrical conductivity and plasmonic performance.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Etchless Fabrication of High‐Quality Refractory Titanium Nitride Nanostructures

Panos

Tselekidou

Kassavetis

et al. 2021

Physica Status Solidi (b)

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“…Therefore, the whole architecture is very 4d) for carrying holes. Furthermore, compared to the preparation of TCO, the involved fabrication method, which utilizes isotropic deposition of high power pulsed magnetron sputtering on relative large TiO 2 (dimension: 250 nm), 18,19 is very simple. The SEM cross-section of the complete device (Figure 4c) shows four obvious layers including 1 μm TiO 2 , 30−80 nm Ti, and 150 nm ZrO 2 porous layers.…”

Section: Methodsmentioning

confidence: 99%

Transparent Conductive Oxide Layer and Hole Selective Layer Free Back-Contacted Hybrid Perovskite Solar Cell

Kapil

Shimazaki

et al. 2017

J. Phys. Chem. C

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Back-contacted architectures have been under intensive investigation for that transparent conductive oxide (TCO) less solar cells (SCs) can be easily realized which avoid the transmission loss of light caused by TCO, typically comprised in conventional solar cells. Here, network-like porous Ti was first utilized as the back-contacted electrode, and a new design allows for a novel backcontacted hybrid perovskite SC without TCO and hole selective layer, which shows a power output of 3.88% with long-term stability. In addition, it avoids limit available collection area of electrodes in the recent reported interdigitated electrode (IDE) based back-contacted TCO-less SCs.

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“…In this context, the reduction in the feature size of the nanopattern is required for higher recording densities. [20] are investigated in order to overcome this issues.…”

Section: )mentioning

confidence: 99%

CoPt/TiN films nanopatterned by RF plasma etching towards dot-patterned magnetic media

Szívós

Pothorszky

Šoltýs

et al. 2018

Applied Surface Science

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Applied Surface Science, because a novel and general (applicable to wide variety of material surfaces and thin films) nanopatterning technique proposed by the authors eariler, is applied here to successfully fabricate dot-patterned CoPt thin films exhibiting perpendicular magnetism. The manuscript topic fits nicely to the accommodated topics as it deals with 2D assembly and nanopatterning of sputter deposited magnetic CoPt thin films. Our results can be considered as a possibility to realize Bit Patterned Media (BPM). Thus, our paper should be of service for researchers interested in fabricating ordered nanopatterns, in particular perpendicular magnetic dot-patterned thin films. Moreover, the technique applied in this paper can easily be scaled to industrial throughput and it is relatively cheap.Cover Letter A C C E P T E D M A N U S C R I P T Highlights  A novel nanopatterning technique proposed recently is applied to CoPt thin films  CoPt films are transformed to L1 0 structure both before and after nanopatterning  Dot-patterned CoPt films with surface-perpendicular magnetic easy axis were obtained  Feature size can be reduced to <20nm and possible to scale to industrial throughput  Our work can be considered as a possibility to realize Bit Patterned Media (BPM) *Highlights (for review) Responses to the Editor and ReviewersEditor:The authors thank to Editor for the remarks. The format of the citations is changed to show all the authors and some more citations towards Applied Surface Science are added to the manuscript. The XRD scales in Figure 4 are corrected as well.Reviewer #1:The authors are thankful to Reviewer #1 for the useful comments and remarks. Here are our answers point-by-point: 1) Magnetic properties of the continues film is missing in current manuscript. I suggest add the in-plane and out-of-plane M-H loop to Fig. 8(a). So that the effect of dot geometry can be clearly observed.The magnetic properties of the annealed but non-patterned CoPt films are described in the authors' previous paper [1]. However, this fact was not mentioned in the in the "magnetic properties" section of the current manuscript. The previous paper was only cited in other sections of the current manuscript. For comparison, the VSM result of an annealed but nonpatterned CoPt film from our previous paper [1] is shown here together with the VSM Fig. 8(a) from the current manuscript. *Response to ReviewersAs it is seen, the two perpendicular measurements are very similar (besides the noise). The coercive force of the patterned sample seems to be somewhat larger, but this can't be stated due to the noise of the measurement. On the other hand, the in-plane hysteresis loop is way smaller in the case of the patterned sample. A few words about this comparison are added to the "magnetic properties section" of the current manuscript together with a citation to our previous paper.2) It will be good also compare the M-H loop before and after annealing. For both dot array and continuous film.For comparison, the Fig 8(a) of the manusc...

show abstract

Nanomesh of Cu fabricated by combining nanosphere lithography and high power pulsed magnetron sputtering and a preliminary study about its function

Cited by 5 publications

References 23 publications

Etchless Fabrication of High‐Quality Refractory Titanium Nitride Nanostructures

Etchless Fabrication of High‐Quality Refractory Titanium Nitride Nanostructures

Transparent Conductive Oxide Layer and Hole Selective Layer Free Back-Contacted Hybrid Perovskite Solar Cell

CoPt/TiN films nanopatterned by RF plasma etching towards dot-patterned magnetic media

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