Nanoparticle sintering simulations

Zeng, Pei; Zajac, Sue M.; Clapp, Philip C.; Rifkin, J.A.

doi:10.1016/s0921-5093(98)00665-0

Cited by 171 publications

(119 citation statements)

References 8 publications

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“…Among various mechanisms 4 contributing to the sintering of bulk crystalline particles only surface diffusion 5 and grain boundary diffusion make a remarkable contribution to nanoscale sintering. In addition, mechanical rotation, plastic deformation via dislocation generation and transmission and amorphization of sub-critical grains play a major role in the early stages of nanoscale sintering (Zeng et al, 1998). Thus sintering kinetics depends strongly on the type of metal observed.…”

Section: Particle Characterization Results and Discussionmentioning

confidence: 99%

Generation of nanoparticles by spark discharge

et al. 2008

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Section: Particle Characterization Results and Discussionmentioning

confidence: 99%

Generation of nanoparticles by spark discharge

et al. 2008

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“…In nanoparticle sintering, it was reported that the surface and the grain boundary diffusion were the most significant transport processes in the sintering process of Cu and Ag nanoparticles. 42 The intermediate stage (Figure 3(C)) begins when the pores reach their equilibrium shapes, as dictated by the surface and interfacial tensions. In this stage, the pore phase is continuous and gives cylindrical channels of porosity sitting along the grain edges, as illustrated in Figure 3(C).…”

Section: Resultsmentioning

confidence: 99%

Sintering and consolidation of silver nanoparticles printed on polyimide substrate films

Yoon

Lee

et al. 2009

Macromol. Res.

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We investigated the sintering and consolidation phenomena of silver nanoparticles under various thermal treatment conditions when they were patterned by a contact printing technique on polyimide substrate films. The sintering of metastable silver nanoparticles commenced at 180 o C, where the point necks were formed at the contact points of the nanoparticles to reduce the overall surface area and the overall surface energy. As the temperature was increased up to 250 o C, silver atoms diffused from the grain boundaries at the intersections and continued to deposit on the interior surface of the pores, thereby filling up the remaining space. When the consolidation temperature exceeded 270 o C, the capillary force between the spherical silver particles and polyimide flat surface induced the permanent deformation of the polyimide films, leaving crater-shaped indentation marks. The bonding force between the patterned silver metal and polyimide substrate was greatly increased by the heat treatment temperature and the mechanical interlocking by the metal particle indentation.

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“…Computer simulations, particularly atomistic simulations, reveal the fundamental mechanisms of nanoparticle sintering and offer a convenient and practical way to investigate small scale phenomena. Many attempts have been made to model nanoparticle sintering using molecular dynamics simulations [12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

Nishikawa¹,

Hirano²,

Takemoto³

et al. 2010

TOSURSJ

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High-temperature bonding, or joining, is a key technology for electronic component assembly and other hightemperature applications. Recently, focusing on the sintering behavior of nanoparticles, the joining process using a nanoparticle paste has been proposed as an alternative to soldering for high-temperature applications. In this study, Cu nanoparticle paste was used to join two Cu discs, and the effect of joining conditions on the joint strength of the Cu-to-Cu joint was investigated. Joining using Cu nanoparticle paste was successfully achieved, but the effect of joining conditions such as heating temperature and joining atmosphere on joint strength of the Cu-to-Cu joint was significant.

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Nanoparticle sintering simulations

Cited by 171 publications

References 8 publications

Generation of nanoparticles by spark discharge

Generation of nanoparticles by spark discharge

Sintering and consolidation of silver nanoparticles printed on polyimide substrate films

Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

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