Nanopatterning on the cylindrical surface using an E-beam pre-mapping algorithm

Abstract

Lithography technology has advanced from flat plates to cylindrical surfaces, aiming to address the emerging needs in flexible and mass-customized applications. Nanoscale ultraprecise patterns have benefited from advanced lithography techniques also involving precision stage technology and material development. While conventional lithography mostly relies on flat wafer-base processing, fabricating nanopatterns on cylindrical surfaces can further expand the applicability and productivity of nanoscale lithography, for example, by integrating with the continuous and scalable plate-to-roll or roll-to-roll nanopatterning techniques. In this regard, we develop a novel nanopatterning methodology that can directly create a nanoscale pattern on the surface of a cylindrical mould by utilizing the E-beam pre-mapping algorithm for uniform E-beam exposure. Here, E-beam pre-mapping was employed to ensure uniform exposure over the cylindrical surface from the planar E-beam source, where the trajectory of the E-beam is modulated along the curved surface of the cylinder based on the pre-calibration of the surface profile. We design and build up a cylindrical exposure system with an E-beam gun that can move at a high degree of freedom. We also perform in-depth analytic modelling and profiling of the target curved surface, which is an essential step for applying E-beam pre-mapping for uniform exposure. By conducting the developed process, we finally achieve a very fine 60 nm scale half-pitch pattern on the cylindrical surface, which may be further extended to enable direct nanopatterning on curved surfaces for many unique applications.

Recent advances in engineering nanotopographic substrates for cell studies

“…Like photolithography, the coating is degraded or crosslinked upon exposure and after a development process, patterns are revealed. While conventional lithography mostly relies on flat wafer-base processing, EBL can be applied on curved surfaces ( Lee et al, 2019 ). However, compared to photolithography, only small areas can be patterned at a time and the equipment manipulation is tough, which makes the whole process significantly slower.…”