2003
DOI: 10.1143/jjap.42.l322
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Nanoprocessing of Carbon and Boron Nitride Nanoperiod Multilayer Films

Abstract: A new low-dielectric-constant spin-on glass (SOG) with a k value of 2.4 has been developed for a gap-filling process in advanced memory devices. The low-shrinkage characteristic of the SOG during thermal curing provides capabilities of gap filling and planarizing as high as those of conventional reflowable SOGs. The low-shrinkage SOG has thermal stability up to 800 C and chemical stability against diluted hydrofluoric acid, sulfuric acid-hydrogen peroxide, and amine-based solutions, which makes it possible to … Show more

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Cited by 20 publications
(15 citation statements)
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“…The modulus of dissipation was calculated by dividing the dissipated energy by the total energy (Donohue et al, 1995;Miyake, 2005). The hardness was evaluated from the plastic deformation depth which was determined from the point of intersection of the straight line fitted to the appropriate unloading curve and the x axis (Doerner & Nix, 1986;Syed Asif et al, 1999;Miyake & Kim, 2003). The total deformation energy of nanoindentation was calculated as the integral of the loading curve.…”
Section: Tribology Evaluation Methodsmentioning
confidence: 99%
“…The modulus of dissipation was calculated by dividing the dissipated energy by the total energy (Donohue et al, 1995;Miyake, 2005). The hardness was evaluated from the plastic deformation depth which was determined from the point of intersection of the straight line fitted to the appropriate unloading curve and the x axis (Doerner & Nix, 1986;Syed Asif et al, 1999;Miyake & Kim, 2003). The total deformation energy of nanoindentation was calculated as the integral of the loading curve.…”
Section: Tribology Evaluation Methodsmentioning
confidence: 99%
“…Using microtribological action and degrees of freedom of materials, the shape and size of processed objects can increase if shape processing is achievable at the micron and nanometer scales [4,5]. Therefore, microfabrication applications can be significantly extended through such novel processes [2][3][4][5][6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the damage remained superficial [18][19][20][21]. In contrast, the direct patterning of etching mask was proposed to reduce damage [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…The dissipated energy was evaluated as the total energy minus the storage energy. The modulus of dissipation was calculated by dividing the dissipated energy by the total energy [18,25].…”
Section: Nanoindentation Hardnessmentioning
confidence: 99%
“…This is particularly due to nanoperiod multilayer films with complex microstructures. Scanning force microscopy (SFM) in combination with the use of diamond-tipped cantilevers can be used to scan or indent surfaces to explore the possibility of high-precision processing on such thin layers and to study mechanical processing characteristics [12,18]. Conductive atomic force microscopy (CAFM) can directly determine a local conductivity distribution using a boron-doped conductive diamond tip, which is independent of topographic information [19].…”
Section: Introductionmentioning
confidence: 99%