Nanoprocessing on Silicon (100) Surface by Using SPM and the Study of the Structural Change

Yoshida, Hiroya; Matsumuro, Akihito; Iwata, Hiroyuki; Takagi, Makoto

doi:10.2493/jjspe.73.1149

Journal of the Japan Society for Precision Engineering

2007

DOI: 10.2493/jjspe.73.1149

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Nanoprocessing on Silicon (100) Surface by Using SPM and the Study of the Structural Change

Hiroya Yoshida¹,

Akihito Matsumuro²,

Hiroyuki Iwata³

et al.

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Cited by 2 publications

References 11 publications

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Cooperated Positioning Control for Ultraprecision Positioning in Extended Stroke Path (Applied to Continuous Step Positioning)

Tamaru¹,

Takafuji²

2011

Trans.JSME(C)

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Cooperative positioning is a positioning technique in which long stroke paths and ultraprecision positioning are combined. These are achieved simultaneously in a single apparatus using extended displacement positioning (EDP) and reduced displacement positioning (RDP), respectively. In the present study, we developed a new control program for a 2-stage hinged cooperative positioning device. RDP is first carried out by a series of step motions of the fine positioning stage. The extended displacement stage is then moved using EDP by an amount equal to the total displacement achieved by RDP. Simultaneously, the fine positioning stage is returned to its initial position using RDP. Continuous step positioning then becomes possible by repeating these operations. The maximum stroke was 67.1 µm and a settling range of less than the EDP displacement resolution (27 nm) was achieved. Some positioning errors were found to occur due to switching between the two types of operation. However, these could be reduced by increasing the EDP control coefficient to improve synchronization, or by decreasing the number of positioning steps. In this way, the amount of overshoot and the settling time could be effectively controlled. Using this apparatus, it was shown that continuous positioning with 25 nm steps was possible.

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Cooperated Positioning Control for Ultraprecision Positioning in Extended Stroke Path (Applied to Continuous Step Positioning)

Tamaru¹,

Takafuji²

2011

Trans.JSME(C)

View full text Add to dashboard Cite

show abstract

Microtribology between Single Crystals of Silicon

Takagi

Turu

Iwata

et al. 2015

J. Japan Inst. Metals and Materials

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Microtribology of silicon single crystals is one of the key technologies from the viewpoint of reliability of practical application to microelectromechanical systems (MEMS). In this study, a silicon single crystal (100) wafer was scratched by a silicon single crystal tip under a very small loading force in an atomic force microscope. The scratched area of the wafer surface was elevated with respect to the original, unscratched surface, forming a terrace. The height of the terrace depended on the number of scratch, but did not depend on the loading force. The terrace was a silicon single crystal which was coherent with the silicon single crystal wafer, in spite of the different crystal orientations between the silicon single crystal wafer and the silicon single crystal tip. The friction force of the scratching was very small and did not depend on the loading force. Based on these results, it was concluded that the contact area between the silicon single crystal wafer and the silicon single crystal tip was molten by heat caused by the friction of scratching. Wear debris was an amorphous SiO 2 .

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Nanoprocessing on Silicon (100) Surface by Using SPM and the Study of the Structural Change

Cited by 2 publications

References 11 publications

Cooperated Positioning Control for Ultraprecision Positioning in Extended Stroke Path (Applied to Continuous Step Positioning)

Cooperated Positioning Control for Ultraprecision Positioning in Extended Stroke Path (Applied to Continuous Step Positioning)

Microtribology between Single Crystals of Silicon

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