Nanostructured Al and Cu alloys with superior strength and electrical conductivity

Murashkin, M. Yu.; Sabirov, I.; Sauvage, Xavier; Valiev, Ruslan Z.

doi:10.1007/s10853-015-9354-9

Cited by 178 publications

(86 citation statements)

References 85 publications

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“…SPD-processing leads to grain refinement followed by solid solution decomposition and subsequent precipitation and can be used as a new approach to enhance mechanical strength of pure metals with retention of electrical conductivity. It was applied to pure Cu [59,60], and recently has been used to process Cu [61,62] and Al-based alloys [19][20][21][22][23]63]. In our case, DA, in the course of ECAP-C, results in solid solution decomposition, which contributes to certain electrical conductivity enhancement ( Table 2).…”

Section: Properties and Microstructure Of The Ufg Alloy Processed Viamentioning

confidence: 99%

Enhanced Mechanical Properties and Electrical Conductivity in Ultrafine-Grained Al 6101 Alloy Processed via ECAP-Conform

Murashkin

Medvedev

Kazykhanov

et al. 2015

Metals

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This paper studies the effect of equal channel angular pressing-Conform (ECAP-C) and further artificial aging (AA) on microstructure, mechanical, and electrical properties of Al 6101 alloy. As is shown, ECAP-C at 130 °C with six cycles resulted in the formation of an ultrafine-grained (UFG) structure with a grain size of 400-600 nm containing nanoscale spherical metastable β′ and stable β second-phase precipitates. As a result, processed wire rods demonstrated the ultimate tensile strength (UTS) of 308 MPa and electrical conductivity of 53.1% IACS. Electrical conductivity can be increased without any notable degradation in mechanical strength of the UFG alloy by further AA at 170 °C and considerably enhanced by additional decomposition of solid solution accompanied by the formation of rod-shaped metastable β′ precipitates mainly in the ultrafine grain interior and by the decrease of the alloying element content in the Al matrix. It is demonstrated that ECAP-C can be used to process Al-Mg-Si wire rods with the specified UFG microstructure. The mechanical strength and electrical conductivity in this case are shown to be much higher than those in the industrial semi-finished products made of similar material processed by the conventional T6 or T81 treatment. OPEN ACCESSMetals 2015, 5 2149

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Section: Properties and Microstructure Of The Ufg Alloy Processed Viamentioning

confidence: 99%

Enhanced Mechanical Properties and Electrical Conductivity in Ultrafine-Grained Al 6101 Alloy Processed via ECAP-Conform

Murashkin

Medvedev

Kazykhanov

et al. 2015

Metals

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“…In this case, nanostructuring the alloys by SPD is of special interest, and this raises fundamental questions concerning new mechanisms of strength and electrical conductivity as well as the innovation potential for practical applications of nanostructured materials. [47][48][49] It was shown that nanostructuring of Al and Cu alloys by SPD processing can significantly increase their mechanical strength with simultaneous improvement in their electrical conductivity (Fig. 3).…”

Section: Nanostructured Al and Cu Alloys With Enhanced Strength And Cmentioning

confidence: 99%

“…3). [49][50][51][52] The development of metallic conductors with such attractive properties is one of the most topical subjects in modern electrical engineering. 50 Given that the global consumer market of AlMg-Si alloys for overhead power transmission lines 53 accounts for about 450,000 tons/year and continues to grow, the R&D activities focused on the improvement of their properties are of keen interest.…”

Section: Nanostructured Al and Cu Alloys With Enhanced Strength And Cmentioning

confidence: 99%

Producing Bulk Ultrafine-Grained Materials by Severe Plastic Deformation: Ten Years Later

Valiev

Estrin

Horita

et al. 2016

JOM

408

186

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It is now well established that the processing of bulk solids through the application of severe plastic deformation (SPD) leads to exceptional grain refinement to the submicrometer or nanometer level. Extensive research over the last decade has demonstrated that SPD processing also produces unusual phase transformations and leads to the introduction of a range of nanostructural features, including nonequilibrium grain boundaries, deformation twins, dislocation substructures, vacancy agglomerates, and solute segregation and clustering. These many structural changes provide new opportunities for fine tuning the characteristics of SPD metals to attain major improvements in their physical, mechanical, chemical, and functional properties. This review provides a summary of some of these recent developments. Special emphasis is placed on the use of SPD processing in achieving increased electrical conductivity, superconductivity, and thermoelectricity, an improved hydrogen storage capability, materials for use in biomedical applications, and the fabrication of high-strength metal-matrix nanocomposites.

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“…The greater number of grain boundaries can also affect the material's electrical properties. However, the electron scattering caused by the grain boundaries and dislocations is less than that caused by other structural defects [31]. This work was initiated to thoroughly investigate the correlation between the microstructural factors (grain shape and size as well as grain boundaries misorientation), the mechanical and functional properties (electrical conductivity and corrosion resistance) and the thermal stability of the deformed sample.…”

Section: Introductionmentioning

confidence: 99%

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

2017

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Samples of electrolytic tough pitch copper were deformed in equal channel angular pressing with enhanced productivity to quickly refine its initial coarsegrained microstructure at room temperature. The evolution in microstructure and changes in a broad range of properties were compared to a sample in the undeformed state. The microstructure evolution was evaluated using electron backscatter diffraction for both states and transmission electron microscopy for a detailed microstructure characterization of the deformed sample. The microstructure observations were correlated with the results of tensile tests, electrochemical tests in 3.5 wt% NaCl, electrical conductivity measurements and thermal stability up to 200°C. The ECAP process employed in this study caused a grain refinement from about 16 µm to about 600 nm. The microstructure refinement caused a 50% increase in both the YS and UTS. The elongation to failure, due to the high amount of LAGBs, maintained a high value of 13.3%. The corrosion and pitting potentials were higher for the deformed sample. Furthermore, the grain refinement caused a decrease in electrical conductivity from 100.2% IACS to 93.1% IACS, a drop of 7% IACS. The deformed sample displayed thermal stability up to a temperature of 175°C, where there was a drop in micro-hardness of more than 10%.

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Nanostructured Al and Cu alloys with superior strength and electrical conductivity

Cited by 178 publications

References 85 publications

Enhanced Mechanical Properties and Electrical Conductivity in Ultrafine-Grained Al 6101 Alloy Processed via ECAP-Conform

Enhanced Mechanical Properties and Electrical Conductivity in Ultrafine-Grained Al 6101 Alloy Processed via ECAP-Conform

Producing Bulk Ultrafine-Grained Materials by Severe Plastic Deformation: Ten Years Later

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

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