Nanostructured Thermal Interfaces

Carbon Nanotubes and Related Nanomaterials: Critical Advances and Challenges for Synthesis toward Mainstream Commercial Applications

“…The thermal interface resistance of a typical electronics package can often comprise the majority of the total thermal resistance. 406 Traditional materials fail to deliver due to either poor thermal conductivity or poor mechanical compliance, and nature does not readily provide soft and compliant materials that conduct heat well. With their extraordinarily high axial thermal conductivity, CNTs have generated tremendous interest as candidates for low resistance thermal interface materials (TIMs).…”

“…In the past several decades, the increasing performance of integrated circuits has put tremendous demand on thermal management solutions. The thermal interface resistance of a typical electronics package can often comprise the majority of the total thermal resistance . Traditional materials fail to deliver due to either poor thermal conductivity or poor mechanical compliance, and nature does not readily provide soft and compliant materials that conduct heat well.…”