For over 20 years, atomic layer deposition (ALD) of platinum
(Pt)
has gained significant achievements in the fabrication of a variety
of Pt nanostructures for applications in different fields, including
microelectronics, sensors, catalysis, and energy conversion, storage,
and utilization devices. By relying on its unique self-saturating
surface reactions with diverse precursor chemistries, tunable deposition
conditions, and various surface engineering methods, ALD offers the
capability of controlling the amount of deposited Pt at the atomic
level precision and enables the fabrication of various low-dimensional
nanostructures, such as single atoms, nanoclusters, core/shell nanoparticles,
and ultrathin continuous films. These ALD-fabricated Pt nanostructures
not only provide outstanding performances but also maximize the Pt
usage efficiency that can address the cost-related issues of Pt. Nevertheless,
to achieve a controllable deposition, it is important to acquire a
deep understanding on the precursor chemistry, the surface reaction,
nucleation, and growth mechanisms, as well as the influence of deposition
conditions and surface engineering, which are the key factors that
govern the growth of Pt. By reviewing the advances in Pt ALD since
its inauguration with the focus on these factors as well as its potential
applications, we expect that this article can provide the fundamentals
of Pt ALD, which may serve as a guide to achieve a desired Pt nanostructure
for a targeted application.