2011 IEEE International Interconnect Technology Conference 2011
DOI: 10.1109/iitc.2011.5940356
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Nanowire filled polymer films for 3D system integration

Abstract: In the present paper, the use of high aspect ratio metallic nanowires (NWs) as functional interconnects between three-dimensionally stacked chips is proposed. First practical preparation steps, as there are the preparation of templates and the deposition of Ag-NWs, are presented. Later on, the applicational technology for vertically aligned NWs is proposed as their embedment into a polymer matrix resulting in an anisotropically conductive composite film. This is discussed in both technological and functional a… Show more

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Cited by 3 publications
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