Natural convection on inclined QFN32 electronic package generating constant volumetric heat flux

Baı̈ri, A.

doi:10.1016/j.icheatmasstransfer.2015.05.016

Cited by 13 publications

(2 citation statements)

References 18 publications

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“…This condition is difficult to achieve when the assembly is subject to natural convection given the weak convective heat transfer coefficients concerning the free areas of the QFN (top and sides). This is clearly shown by Baïri (2015a, 2016a) for the QFN16 model, by Baïri (2015b) and Baïri and Haddad (2016) for the QFN32, by Baïri (2015c, 2016b) for the wire bonded versions 16b and 32b, respectively, and by Baïri et al (2017) for the QFN64. These works are valid in wide ranges of the generated power up to 1W and for devices tilted between horizontal and vertical positions.…”

Section: Introductionmentioning

confidence: 81%

Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection

Baı̈ri

Hermoso

Ortega

et al. 2017

HFF

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Purpose This work deals with the case of the quad flat non-lead 64 (QFN64) electronic package generating a low power range ranging from 0.01 to 0.1W. It is installed on one side of a printed circuit board (PCB) that can be inclined relative to the horizontal plane with an angle varying between 0° and 90° (horizontal and vertical positions, respectively). The surface temperature of the electronic assembly is subjected to air natural convection. Design/methodology/approach Calculations are done by means of the finite volume method for many configurations obtained by varying the generated power and the inclination angle. Findings The distribution of the surface temperature is determined on all the assembly areas (QFN and PCB). The study shows that the thermal behaviour of the electronic device is influenced by the generated power and the inclination angle. The 3D numerical survey leads to correlations allowing calculation of the average surface temperature in any part of the assembly, according to the power generated by the QFN64 and the inclination angle. Originality/value The proposed accurate correlations are original and unpublished. They optimize the thermal design of the electronic QFN64 package, which is increasingly used in many engineering fields.

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Section: Introductionmentioning

confidence: 81%

Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection

Baı̈ri

Hermoso

Ortega

et al. 2017

HFF

View full text Add to dashboard Cite

show abstract

“…6,7 This approach, however, provides only the information about the average expected lifetime for a specific working condition without providing any indication about the ongoing failure mechanism and, as a consequence, without providing directions to improve reliability. Numerical modeling can be applied to evaluate thermal field in electronic components 8 or to evaluate how a given thermal input determines deformations and stress concentration on the component as well as at the wire-to-chip interface. 9 However, it should be underlined that due to the high complexity of the modern electronic components and devices, many input data are required in order to have an accurate model or, as an alternative, several approximations have to be done that can affect the final accuracy of the simulation.…”

Section: Introductionmentioning

confidence: 99%

Double wavelength combined electronic speckle pattern interferometry–moiré system for full-field strain analysis on electronic components

Casavola

Pappalettera

2018

The Journal of Strain Analysis for Engineering Design

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Determination of thermal dissipation capability and thermomechanical behavior of electronic components is becoming a relevant topic in view of the fact that thermal management can strongly affect reliability and lifetime of the component. The level of miniaturization, which is achieved in current electronics, requires that no-contact analysis must be privileged in view of the fact that any contact with the chip can significantly alter the heat capacity of the component and to introduce a systematic bias in the measurements. Moreover, the high complexity of electronics components suggests that fullfield methods should be adopted in order to take into account about differences in terms of thermomechanical response in different areas of the same sample. In this article, an original optical setup including a speckle interferometer and a projection moiré branch was developed; this system comprises two different laser sources emitting at two different wavelengths. Recording by a color camera allows detecting simultaneously the speckle pattern and the projected fringes. The whole information is successively separated in the post-processing stage and this allows obtaining in-plane and outof-plane displacement fields. The system demonstrated its capability to determine dynamic response of the LM1084 analyzed component and, moreover, to detect the presence of a functional damage.

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Natural Convection of Power-Law Fluids Inside an Internally Finned Horizontal Annulus

Hadidi

Manshadi

Kamali

2018

Iran J Sci Technol Trans Mech Eng

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Natural convection on inclined QFN32 electronic package generating constant volumetric heat flux

Cited by 13 publications

References 18 publications

Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection

Surface temperature of electronic assemblies equipped with tilted and low-powered QFN64 subjected to free convection

Double wavelength combined electronic speckle pattern interferometry–moiré system for full-field strain analysis on electronic components

Natural Convection of Power-Law Fluids Inside an Internally Finned Horizontal Annulus

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