Natural rubber composites with enhanced thermal conductivity fabricated via modification of boron nitride by covalent and non-covalent interactions

Yang, Dan; Wei, Qungui; Yu, Liyuan; Ni, Yufeng; Zhang, Liqun

doi:10.1016/j.compscitech.2020.108590

Cited by 51 publications

(20 citation statements)

References 55 publications

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“…The TIMs yielded a high stretchability (∼400%) but still had a moderate increase of thermal conductivity (0.81 W m –1 K –1 ), 5.4-fold higher than that of neat nature rubber (0.15 W m –1 K –1 ). The mechanical performances of BN-PCPA-Si69/NR composites also improved significantly with the maximum tensile strength reaching up 17.0 MPa . It remains largely unexplored to engineer stretchable and thermally conductive TIMs.…”

Section: Introductionmentioning

confidence: 98%

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Stretchable Thermal Interface Materials by Tailoring the Chain Relaxation at the Filler/Polymer Interface

Liang

et al. 2022

ACS Appl. Polym. Mater.

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Polymer-based thermal interface materials integrated with excellent stretchability and simultaneously high thermal conductivity would be of great use in the thermal management of next-generation chips featuring higher power density and a larger packaging size. However, combining thermal conductivity and stretchability in the same material is fundamentally challenging. Herein, in view of the important role of filler/polymer interface, we report a stretchable thermal interface material by tailoring chain relaxation through incorporating macromolecular coupling agent at the aluminum/silicone interface. Thanks to the interfacial relaxation effect, the aluminum/silicone thermal interface material exhibits a large stretchability (117%) and a high thermal conductivity (5.90 W m–1 K–1) at the aluminum weight fraction of 91 wt %. Moreover, these materials show great heat dissipation performance in practical applications, which we demonstrated by rapid heat dissipation in LED and chip. This strategy will provide an avenue to implement interface design for high-performance thermal interface materials for high-performance applications, such as high-performance computing, the Internet of Things, 5G networking, and artificial intelligence computing.

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Section: Introductionmentioning

confidence: 98%

“…The mechanical performances of BN-PCPA-Si69/NR composites also improved significantly with the maximum tensile strength reaching up 17.0 MPa. 13 It remains largely unexplored to engineer stretchable and thermally conductive TIMs.…”

Section: ■ Introductionmentioning

confidence: 99%

Stretchable Thermal Interface Materials by Tailoring the Chain Relaxation at the Filler/Polymer Interface

Liang

et al. 2022

ACS Appl. Polym. Mater.

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“…Adding 4 wt% modified boron nitride can significantly improve the flame retardant performance and thermal conductivity of natural rubber. Yang et al 17 modified h-BN with polycatechol/polyamine (PCPA) and united it with bis-(γ-triethoxysilylpropyl)-tetrasulfide (Si69) to get BN-PCPA-Si69 and then applied it to natural rubber. The research indicated that the PCPA coating decreased the interface phonon dispersion between the substrate and the filler and effectively improved the thermal conductivity of natural rubber.…”

Section: Introductionmentioning

confidence: 99%

Preparation of boron nitride hybrid containing phosphorus and silicon and its effect on flame retardant, smoke suppression, and thermal conductivity properties of styrene‐butadiene rubber

Cheng

Ding

et al. 2022

J of Applied Polymer Sci

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In this study, a nanofiller (M-DOPO-BN) was synthesized by surface modification of hexagonal boron nitride with vinyltrimethoxysilane (KH-171) and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), and compounded with aluminum diethyl phosphinate (ADP) to study their effects on flame retardant, smoke suppression and thermal conductivity properties of styrene-butadiene rubber (SBR). The results showed that the composites with an ADP content of 20 parts per hundred of rubber (phr) have good flame retardant properties, but the total smoke production increased significantly. The flame retardant properties of SBR composites compounded with

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“…In general, metallic, , carbon materials, , and ceramic materials , are introduced into the polymers to improve λ of the polymeric composites. , Hexagonal boron nitride (BN) is incorporated in various polymers due to its high λ (∼30 W/mK in the through-plane direction and ∼600 W/mK in the in-plane direction), outstanding electrical insulation, and high-temperature antioxidation resistance. − Due to the honeycomb atom layered structure that is similar to graphite, BN is usually called “white graphene” . However, owing to their high specific surface area, BN platelets usually agglomerate at high loadings, which induces more interfacial thermal barriers and decreases the λ of polymeric composites.…”

Section: Introductionmentioning

confidence: 99%

Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

Gao

Yang

et al. 2021

Ind. Eng. Chem. Res.

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With the advent of the 5G era, hexagonal boron nitride (BN) platelets are ideal fillers to incorporate into polymers for preparing thermally conductive composites, which are applied in relieving the heat dissipation in electronic devices. In this study, we report a green, low cost, and high-efficient method to improve the thermal conductivity (λ) of carboxylated acrylonitrile-butadiene rubber (XNBR) composites via noncovalent modification of boron nitride (BN) via tannic acid (TA) chemistry. The noncovalent TA decorating on the surface of BN without deteriorating the surface structure of BN platelets ensures the high intrinsic λ of BN. Additionally, TA enhances the interfacial compatibility between the filler and matrix, as well as the formation of a thermally conductive path in the composites. The maximum throughplane λ is obtained by 30 vol % BN-TA-XNBR composite as 0.42 W/mK, which is 260% of that for pure XNBR (0.16 W/mK). The excellent dielectric properties of BN-TA-XNBR composites also indicates that the BN-TA-XNBR composites can meet the requirements of high capacitance and low energy loss of electronic devices. In brief, the TA chemistry provides potential applications in large scale production of thermally conductive composites in industries, as well as paves the way for advanced applications in nextgeneration miniaturization and integration of electronic devices.

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Natural rubber composites with enhanced thermal conductivity fabricated via modification of boron nitride by covalent and non-covalent interactions

Cited by 51 publications

References 55 publications

Stretchable Thermal Interface Materials by Tailoring the Chain Relaxation at the Filler/Polymer Interface

Stretchable Thermal Interface Materials by Tailoring the Chain Relaxation at the Filler/Polymer Interface

Preparation of boron nitride hybrid containing phosphorus and silicon and its effect on flame retardant, smoke suppression, and thermal conductivity properties of styrene‐butadiene rubber

Improved Thermal Conductivity of Polymer Composites by Noncovalent Modification of Boron Nitride via Tannic Acid Chemistry

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