2021
DOI: 10.1016/j.rinma.2021.100191
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Nature of creep deformation in nanocrystalline cupronickel alloy: A Molecular Dynamics study

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Cited by 7 publications
(2 citation statements)
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“…Consequently, the molecular simulation method has played an important role to investigate the atomic behaviors at high temperatures or during the melting process. For examples, in Rahman’s MD simulation results 24 , they found the steady-state creeping rate of nanocrystalline Cu 0.5 Ni 0.5 alloy speeds up dramatically under the elevated stress and temperature as well as the decreasing grain size. The lattice and grain boundary diffusion play a critical factor of creeping deformation mechanism of the nanocrystalline Cu 0.5 Ni 0.5 alloy.…”
Section: Introductionmentioning
confidence: 99%
“…Consequently, the molecular simulation method has played an important role to investigate the atomic behaviors at high temperatures or during the melting process. For examples, in Rahman’s MD simulation results 24 , they found the steady-state creeping rate of nanocrystalline Cu 0.5 Ni 0.5 alloy speeds up dramatically under the elevated stress and temperature as well as the decreasing grain size. The lattice and grain boundary diffusion play a critical factor of creeping deformation mechanism of the nanocrystalline Cu 0.5 Ni 0.5 alloy.…”
Section: Introductionmentioning
confidence: 99%
“…Consequently, the molecular simulation method has played an important role to investigate the atomic behaviors at high temperatures or during the melting process. For examples, in Rahman's MD simulation results [17], they found the steady-state creeping rate of Cu0.5Ni0.5 alloy speeds up dramatically under the elevated stress and temperature as well as the decreasing grain size. The lattice and grain boundary diffusion play a critical factor of creeping deformation mechanism of the NC Cu0.5Ni0.5 alloy.…”
Section: Introductionmentioning
confidence: 99%