2014
DOI: 10.1002/pssb.201451363
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Nature of electrical resistivity and structural stability in N-doped GeTe models for reliable phase-change materials

Abstract: We study the effects of nitrogen (N)‐doping on the electrical memory reliability of GeSbTe phase‐change materials based on GeTe prototype models. We find that the loss of secondary bonding (e.g., resonant interlayer bonding) determines the feasibility of various types of N‐doping that can be easily adopted by the GeSbTe system. We give a more generalized explanation beyond compliance with the formation of local Ge3N4 motifs. The nitrogen‐induced change in local order produces crystalline GeTe with shallow stat… Show more

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Cited by 11 publications
(4 citation statements)
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“…, Overall, the typical crystallization temperature of these ALD films corresponds to the reported crystallization temperature of the sputtered GeTe film (180–190 °C). , The crystallization temperature is similar to that of the undoped GeTe despite the presence of the C and N impurities as observed in the AES. The impurities in this study exist without chemical bonding to the Ge or Te atoms as confirmed by XPS, which is distinguished from the previous cases where the impurities bind to the Ge atoms and increase the crystallization temperature. , …”
Section: Resultsmentioning
confidence: 54%
See 1 more Smart Citation
“…, Overall, the typical crystallization temperature of these ALD films corresponds to the reported crystallization temperature of the sputtered GeTe film (180–190 °C). , The crystallization temperature is similar to that of the undoped GeTe despite the presence of the C and N impurities as observed in the AES. The impurities in this study exist without chemical bonding to the Ge or Te atoms as confirmed by XPS, which is distinguished from the previous cases where the impurities bind to the Ge atoms and increase the crystallization temperature. , …”
Section: Resultsmentioning
confidence: 54%
“…The impurities in this study exist without chemical bonding to the Ge or Te atoms as confirmed by XPS, which is distinguished from the previous cases where the impurities bind to the Ge atoms and increase the crystallization temperature. 32,33 Figure 10a shows the cross-sectional TEM image and composition mapping results using the EDS technique of the GeTe film deposited on a high-aspect-ratio hole structure at 170 °C. The opening diameter and depth of the holes was ∼100 and ∼2900 nm, respectively, giving rise to an aspect ratio of ∼29.…”
Section: Resultsmentioning
confidence: 99%
“…A weakness of the a-GeSe-type alloys as selectors is that their off-current is too high. This can be counteracted by alloying with N or C 4349 as is well known previously. The addition of N or C both widens the band gap, reducing off-current, and also reduces atomic diffusion and nucleation rates, so raising the crystallization temperature.…”
Section: Calculationsmentioning
confidence: 92%
“…A similar concept has been successfully utilized in other solid functional materials in our theoretical modeling. 34,[41][42][43] The key difference between UMPL materials and conventional PL materials is that the electrons and holes can be separated and allocated at the deep localized levels in the optical band gap area, due to the extra deep trap levels near the valence band maximum (VBM) and the extra hole traps near the conduction band maximum (CBM), as shown in Fig. 1.…”
Section: Introductionmentioning
confidence: 99%