Encapsulation
for carbon-based electronic devices against oxidation
can enhance their long-term working stability. Graphene glass fiber
fabric (GGFF), as an advanced flexible electrothermal material, also
struggles with graphene oxidation. The flexible, full-surface, conformal
encapsulation for each fiber in the large-area fabric puts forward
high requirements for encapsulating materials and techniques. Herein,
the nanometer-thick h-BN layer was in situ grown
on cambered surfaces of each fiber in GGFF with the chemical vapor
deposition method. Stable heating duration (500 °C) of h-BN-encapsulated GGFF (h-BN/GGFF) was
increased by 1 order of magnitude without compromising the electrothermal
performances and flexibility. Theoretical simulations revealed that
the enhanced oxidation resistance of h-BN/GGFF was
attributed to the decreased interaction and adsorption life of oxygen.
The proposed flexible, full-surface, conformal encapsulation technique
targeting the fiber-shaped graphene electrothermal device is scalable
and can be extended to the other carbon materials, even devices with
intricate shapes, which will promote the development of flexible electronics.